Abstract
I am honored to receive this year's IEEE Pioneer Award in Nanotechnology. I would like to use this opportunity to share three nanotechnology approaches we have developed and our vision on how these could contribute to the continued scaling of semiconductor technologies in 3D and by heterogeneous integration, with plenty of room all-around.
Original language | English (US) |
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Pages (from-to) | 26-30 |
Number of pages | 5 |
Journal | IEEE Nanotechnology Magazine |
Volume | 17 |
Issue number | 1 |
DOIs | |
State | Published - Feb 1 2023 |
Externally published | Yes |
ASJC Scopus subject areas
- Mechanical Engineering
- Electrical and Electronic Engineering