The v-line: A new interconnect for packaging and microwave applications

Research output: Contribution to journalConference article

Abstract

A new transmission line configuration is presented for microwave and high-speed digital applications. The structure consists of a conducting strip over a triangular ground reference and offer superior electromagnetic performance at higher frequencies with lower radiation and lower coupling between neighboring interconnect lines. Parameters resulting from a static analysis are shown as a function of the geometrical characteristics and a full wave analysis is used to establish the frequency dependence of the propagation constant. Experimental results are compared with the theoretical data to validate the analysis and determine the advantages of the new structure.

Original languageEnglish (US)
Pages (from-to)138-143
Number of pages6
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume1389
DOIs
StatePublished - Apr 1 1991
EventMicroelectronic Interconnects and Packages: Optical and Electrical Technologies 1990 - Boston, United States
Duration: Nov 4 1990Nov 9 1990

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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