The v-line: A new interconnect for packaging and microwave applications

Research output: Contribution to journalConference article

Abstract

A new transmission line configuration is presented for microwave and high-speed digital applications. The structure consists of a conducting strip over a triangular ground reference and offer superior electromagnetic performance at higher frequencies with lower radiation and lower coupling between neighboring interconnect lines. Parameters resulting from a static analysis are shown as a function of the geometrical characteristics and a full wave analysis is used to establish the frequency dependence of the propagation constant. Experimental results are compared with the theoretical data to validate the analysis and determine the advantages of the new structure.

Original languageEnglish (US)
Pages (from-to)138-143
Number of pages6
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume1389
DOIs
StatePublished - Apr 1 1991
EventMicroelectronic Interconnects and Packages: Optical and Electrical Technologies 1990 - Boston, United States
Duration: Nov 4 1990Nov 9 1990

Fingerprint

Packaging
Static analysis
Interconnect
packaging
Microwave
transmission lines
Electric lines
strip
Microwaves
high speed
electromagnetism
Radiation
microwaves
conduction
propagation
Line
Transmission Line
radiation
Static Analysis
configurations

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

Cite this

The v-line : A new interconnect for packaging and microwave applications. / Schutt-Aine, Jose E.; Lee, Jin Fa.

In: Proceedings of SPIE - The International Society for Optical Engineering, Vol. 1389, 01.04.1991, p. 138-143.

Research output: Contribution to journalConference article

@article{9c191fec261f4b9285e6c449608aecad,
title = "The v-line: A new interconnect for packaging and microwave applications",
abstract = "A new transmission line configuration is presented for microwave and high-speed digital applications. The structure consists of a conducting strip over a triangular ground reference and offer superior electromagnetic performance at higher frequencies with lower radiation and lower coupling between neighboring interconnect lines. Parameters resulting from a static analysis are shown as a function of the geometrical characteristics and a full wave analysis is used to establish the frequency dependence of the propagation constant. Experimental results are compared with the theoretical data to validate the analysis and determine the advantages of the new structure.",
author = "Schutt-Aine, {Jose E.} and Lee, {Jin Fa}",
year = "1991",
month = "4",
day = "1",
doi = "10.1117/12.25516",
language = "English (US)",
volume = "1389",
pages = "138--143",
journal = "Proceedings of SPIE - The International Society for Optical Engineering",
issn = "0277-786X",
publisher = "SPIE",

}

TY - JOUR

T1 - The v-line

T2 - A new interconnect for packaging and microwave applications

AU - Schutt-Aine, Jose E.

AU - Lee, Jin Fa

PY - 1991/4/1

Y1 - 1991/4/1

N2 - A new transmission line configuration is presented for microwave and high-speed digital applications. The structure consists of a conducting strip over a triangular ground reference and offer superior electromagnetic performance at higher frequencies with lower radiation and lower coupling between neighboring interconnect lines. Parameters resulting from a static analysis are shown as a function of the geometrical characteristics and a full wave analysis is used to establish the frequency dependence of the propagation constant. Experimental results are compared with the theoretical data to validate the analysis and determine the advantages of the new structure.

AB - A new transmission line configuration is presented for microwave and high-speed digital applications. The structure consists of a conducting strip over a triangular ground reference and offer superior electromagnetic performance at higher frequencies with lower radiation and lower coupling between neighboring interconnect lines. Parameters resulting from a static analysis are shown as a function of the geometrical characteristics and a full wave analysis is used to establish the frequency dependence of the propagation constant. Experimental results are compared with the theoretical data to validate the analysis and determine the advantages of the new structure.

UR - http://www.scopus.com/inward/record.url?scp=0025840940&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0025840940&partnerID=8YFLogxK

U2 - 10.1117/12.25516

DO - 10.1117/12.25516

M3 - Conference article

AN - SCOPUS:0025840940

VL - 1389

SP - 138

EP - 143

JO - Proceedings of SPIE - The International Society for Optical Engineering

JF - Proceedings of SPIE - The International Society for Optical Engineering

SN - 0277-786X

ER -