The use of shape memory polymers for microassembly by transfer printing

Jeffrey D. Eisenhaure, Sang Il Rhee, Ala'A M. Al-Okaily, Andrew Carlson, Placid M. Ferreira, Seok Kim

Research output: Contribution to journalArticlepeer-review


The advantages of utilizing the polymeric shape memory effect for deterministic assembly of microscale objects are explored in this letter. The assembly is performed by transfer printing, which involves a polymeric stamp with reversible adhesion as a manipulator. The dynamic rigidity control afforded by heating or cooling a shape memory polymer (SMP) stamp across its glass transition temperature allows for a dramatic increase in adhesion during pick-up. Furthermore, the shape-fixing and recovery property of the SMP material enables substantial freedom in stamp design, such as more complex surface patterning and heterogeneous surface features to further reduce adhesion during release not otherwise available. [2014-0158]

Original languageEnglish (US)
Article number6879234
Pages (from-to)1012-1014
Number of pages3
JournalJournal of Microelectromechanical Systems
Issue number5
StatePublished - Oct 1 2014


  • Shape memory polymer
  • dry adhesives
  • microassembly
  • reversible adhesion
  • transfer printing

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering


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