The microstructure and mechanical behavior of deformed silicon

Seongwon Kim, Hyung Tae Kim, Jian Min Zuo, Jerome Pacaud

Research output: Contribution to journalArticle

Abstract

The microstructure and mechanical behavior of deformed silicon were characterized using transmission electron microscopy and nanoindentation. Structural defects such as stacking faults and dislocations were observed through the diffraction contrast in transmission electron microscopy. The mechanical properties of deformed Si and 111 Si wafer and mechanical behaviors during contact loading were also characterized using nanoindentation. The hardness values of silicon samples were ∼10 GPa and the elastic modulus were varied with indentation conditions. Elbow or pop-out behaviors were found in load-displacement curves of silicon samples during nanoindentation. Deformed silicon showed 'pop-out' behavior more frequently under the load of 10 mN, which is attributed to the structural defects in deformed silicon.

Original languageEnglish (US)
Pages (from-to)510-514
Number of pages5
JournalJournal of the Korean Ceramic Society
Volume46
Issue number5
DOIs
StatePublished - Sep 1 2009

Keywords

  • Deformed silicon
  • Mechanical behavior
  • Microstructure
  • Nanoindentation

ASJC Scopus subject areas

  • Ceramics and Composites

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