The IEEE EPS Packaging Benchmark Suite

Fei Guo, Kemal Aygun, W. Dale Becker, Stefano Grivet Talocia, Jose A. Hejase, Wui Weng Wong, Tingdong Zhou, Heidi Barnes, Zhen Peng, Alexander Pelger, Mohamed Sahouli, Jose Schutt-Aine, Feng Ling, Elmar Griese, Pavel Roy Paladhi, Rohit Sharma, Nam Pham, Thomas Michael Winkel, Evan Fledell, Michael J. HillBenjamin Silva, Kaisheng Hu, Jonatan Aronsson, Chang Liu, Yiru Jeong, Ali E. Yilmaz

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The current state of the Packaging Benchmark Suite being developed by the IEEE EPS technical committee on electrical design, modeling, and simulation (TC-EDMS) is reviewed. The history and goals of the effort to establish the Suite, the key requirements from benchmarks that can support advances in simulation tools and computational methods, and the process being followed by the volunteer committee formed by the authors to produce the Suite are described. The first three benchmarks in the Suite and the steps that were taken to elevate them from potential candidates to effective benchmarks are presented.

Original languageEnglish (US)
Title of host publicationEPEPS 2021 - IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781665442695
DOIs
StatePublished - 2021
Event30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021 - Austin, United States
Duration: Oct 17 2021Oct 20 2021

Publication series

NameEPEPS 2021 - IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems

Conference

Conference30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021
Country/TerritoryUnited States
CityAustin
Period10/17/2110/20/21

Keywords

  • benchmarking
  • computer-aided design
  • scientific method
  • technical collaboration
  • validation
  • verification

ASJC Scopus subject areas

  • Safety, Risk, Reliability and Quality
  • Electronic, Optical and Magnetic Materials
  • Hardware and Architecture
  • Electrical and Electronic Engineering

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