@inproceedings{708bea04021f4657a9dcd0907b981ba5,
title = "The IEEE EPS Packaging Benchmark Suite",
abstract = "The current state of the Packaging Benchmark Suite being developed by the IEEE EPS technical committee on electrical design, modeling, and simulation (TC-EDMS) is reviewed. The history and goals of the effort to establish the Suite, the key requirements from benchmarks that can support advances in simulation tools and computational methods, and the process being followed by the volunteer committee formed by the authors to produce the Suite are described. The first three benchmarks in the Suite and the steps that were taken to elevate them from potential candidates to effective benchmarks are presented.",
keywords = "benchmarking, computer-aided design, scientific method, technical collaboration, validation, verification",
author = "Fei Guo and Kemal Aygun and {Dale Becker}, W. and Talocia, {Stefano Grivet} and Hejase, {Jose A.} and Wong, {Wui Weng} and Tingdong Zhou and Heidi Barnes and Zhen Peng and Alexander Pelger and Mohamed Sahouli and Jose Schutt-Aine and Feng Ling and Elmar Griese and Paladhi, {Pavel Roy} and Rohit Sharma and Nam Pham and Winkel, {Thomas Michael} and Evan Fledell and Hill, {Michael J.} and Benjamin Silva and Kaisheng Hu and Jonatan Aronsson and Chang Liu and Yiru Jeong and Yilmaz, {Ali E.}",
note = "Publisher Copyright: {\textcopyright} 2021 IEEE.; 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021 ; Conference date: 17-10-2021 Through 20-10-2021",
year = "2021",
doi = "10.1109/EPEPS51341.2021.9609142",
language = "English (US)",
series = "EPEPS 2021 - IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "EPEPS 2021 - IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems",
address = "United States",
}