The effects of temperature and humidity on the growth of tin whisker and hillock from Sn5Nd alloy

Cai Fu Li; Zhi Quan Liu; Jian Ku Shang

doi:10.1016/j.jallcom.2012.09.092

The effects of temperature and humidity on the growth of tin whisker and hillock from Sn5Nd alloy

Cai Fu Li, Zhi Quan Liu, Jian Ku Shang

Research output: Contribution to journal › Article › peer-review

Abstract

The effects of exposure time, temperature and humidity on the growth of tin whisker and hillock from Sn5Nd alloy were investigated via scanning electron microscopy. It was found that tin whiskers grew from NdSn₃ compound, while hillocks grew from the tin matrix around the NdSn₃ compound, which was induced by the oxidation of NdSn₃ compound by oxygen and water vapor in the ambient. More tin whiskers and/or hillocks were extruded from the substrate with longer exposure time, higher temperature and higher humidity. This resulted in the formation of various morphologies of tin extrusions at different storage conditions, including thread-like, spiral, flute-like, claw-like, sprout-like, chrysanthemum-like and rod-like whiskers, as well as hillocks. Tin whisker was extruded from the crack of the surface Nd(OH)₃ layer which serves as the mold of tin whisker growth. And the proposed growth models of tin whisker and hillock on Sn-Nd alloy can explain the diversity of the whisker morphology.

Original language	English (US)
Pages (from-to)	231-238
Number of pages	8
Journal	Journal of Alloys and Compounds
Volume	550
DOIs	https://doi.org/10.1016/j.jallcom.2012.09.092
State	Published - Feb 15 2013
Externally published	Yes

Keywords

Growth mechanism
Hillock
NdSn
Oxidation
Tin whisker

ASJC Scopus subject areas

Mechanics of Materials
Mechanical Engineering
Metals and Alloys
Materials Chemistry

Online availability

10.1016/j.jallcom.2012.09.092

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title = "The effects of temperature and humidity on the growth of tin whisker and hillock from Sn5Nd alloy",

abstract = "The effects of exposure time, temperature and humidity on the growth of tin whisker and hillock from Sn5Nd alloy were investigated via scanning electron microscopy. It was found that tin whiskers grew from NdSn3 compound, while hillocks grew from the tin matrix around the NdSn3 compound, which was induced by the oxidation of NdSn3 compound by oxygen and water vapor in the ambient. More tin whiskers and/or hillocks were extruded from the substrate with longer exposure time, higher temperature and higher humidity. This resulted in the formation of various morphologies of tin extrusions at different storage conditions, including thread-like, spiral, flute-like, claw-like, sprout-like, chrysanthemum-like and rod-like whiskers, as well as hillocks. Tin whisker was extruded from the crack of the surface Nd(OH)3 layer which serves as the mold of tin whisker growth. And the proposed growth models of tin whisker and hillock on Sn-Nd alloy can explain the diversity of the whisker morphology.",

keywords = "Growth mechanism, Hillock, NdSn, Oxidation, Tin whisker",

author = "Li, {Cai Fu} and Liu, {Zhi Quan} and Shang, {Jian Ku}",

note = "Funding Information: We gratefully acknowledge the financial support from the Hundred Talents Program of the Chinese Academy of Sciences , Shenyang Science and Technology Project (Grant No. F11-264-1-65 ), the National Basic Research Program of China (Grant No. 2010CB631006 ), and the Major National Science and Technology Program of China (Grant No. 2011ZX02602 ).",

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AU - Li, Cai Fu

AU - Liu, Zhi Quan

AU - Shang, Jian Ku

N1 - Funding Information: We gratefully acknowledge the financial support from the Hundred Talents Program of the Chinese Academy of Sciences , Shenyang Science and Technology Project (Grant No. F11-264-1-65 ), the National Basic Research Program of China (Grant No. 2010CB631006 ), and the Major National Science and Technology Program of China (Grant No. 2011ZX02602 ).

PY - 2013/2/15

Y1 - 2013/2/15

N2 - The effects of exposure time, temperature and humidity on the growth of tin whisker and hillock from Sn5Nd alloy were investigated via scanning electron microscopy. It was found that tin whiskers grew from NdSn3 compound, while hillocks grew from the tin matrix around the NdSn3 compound, which was induced by the oxidation of NdSn3 compound by oxygen and water vapor in the ambient. More tin whiskers and/or hillocks were extruded from the substrate with longer exposure time, higher temperature and higher humidity. This resulted in the formation of various morphologies of tin extrusions at different storage conditions, including thread-like, spiral, flute-like, claw-like, sprout-like, chrysanthemum-like and rod-like whiskers, as well as hillocks. Tin whisker was extruded from the crack of the surface Nd(OH)3 layer which serves as the mold of tin whisker growth. And the proposed growth models of tin whisker and hillock on Sn-Nd alloy can explain the diversity of the whisker morphology.

AB - The effects of exposure time, temperature and humidity on the growth of tin whisker and hillock from Sn5Nd alloy were investigated via scanning electron microscopy. It was found that tin whiskers grew from NdSn3 compound, while hillocks grew from the tin matrix around the NdSn3 compound, which was induced by the oxidation of NdSn3 compound by oxygen and water vapor in the ambient. More tin whiskers and/or hillocks were extruded from the substrate with longer exposure time, higher temperature and higher humidity. This resulted in the formation of various morphologies of tin extrusions at different storage conditions, including thread-like, spiral, flute-like, claw-like, sprout-like, chrysanthemum-like and rod-like whiskers, as well as hillocks. Tin whisker was extruded from the crack of the surface Nd(OH)3 layer which serves as the mold of tin whisker growth. And the proposed growth models of tin whisker and hillock on Sn-Nd alloy can explain the diversity of the whisker morphology.

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KW - Oxidation

KW - Tin whisker

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The effects of temperature and humidity on the growth of tin whisker and hillock from Sn5Nd alloy

Abstract

Keywords

ASJC Scopus subject areas

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