The effect of additives on morphology evolution during copper electrodeposition

Research output: Contribution to conferencePaperpeer-review


In this overview, advances in experimental and computational approaches for the study of additive effects on copper morphology evolution during electrodeposition are summarized for both continuum and non-continuum regions of behavior. Deposit quality is determined at the molecular scale by the action of additives. Emphasis is therefore placed on integration of experimental data and qualitative hypotheses with computational strategies in order to understand behavior at the non-continuum level. In addition, emphasis is also given to the linkage of non-continuum simulations with traditional electrochemical engineering tools that use continuum methods to compute potential and current distribution phenomena in macroscopic systems. The use multiscale, multi-phenomena numerical simulation offers promise for speeding innovation as well as design of advanced technological applications.

Original languageEnglish (US)
Number of pages16
StatePublished - 2001

ASJC Scopus subject areas

  • General Engineering


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