Test chip design for study of CDM related failures in SoC designs

Nicholas Olson, Vrashank Shukla, Elyse Rosenbaum

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

During CDM-ESD testing, SoC (System on a Chip) designs may fail either in the pad ring or in the core circuitry, particularly at the power domain crossings. A specially designed test chip allows one to locate the sites at which ESD-induced damage occurs and also to investigate the efficacy of different CDM protection strategies.

Original languageEnglish (US)
Title of host publication2011 International Reliability Physics Symposium, IRPS 2011
DOIs
StatePublished - Jun 23 2011
Event49th International Reliability Physics Symposium, IRPS 2011 - Monterey, CA, United States
Duration: Apr 10 2011Apr 14 2011

Publication series

NameIEEE International Reliability Physics Symposium Proceedings
ISSN (Print)1541-7026

Other

Other49th International Reliability Physics Symposium, IRPS 2011
Country/TerritoryUnited States
CityMonterey, CA
Period4/10/114/14/11

Keywords

  • CDM
  • ESD
  • System on a chip

ASJC Scopus subject areas

  • Engineering(all)

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