Temperature Mapping of Stacked Silicon Dies from X-Ray-Diffraction Intensities

Keyphrases

• Temperature Mapping 100%
• Stacked Silicon 100%
• Silicon Die 100%
• X-ray Diffraction Intensity 100%
• Integrated Circuits 66%
• Thermal Hotspot 66%
• 3D IC 66%
• 3D Structure 33%
• Temperature Effect 33%
• Spatial Resolution 33%
• Penetration Depth 33%
• Diffraction Intensity 33%
• Power Density 33%
• Temporal Resolution 33%
• X-ray 33%
• Downscaling 33%
• High Penetration 33%
• Optical Resonance 33%
• Magnetic Resonance Techniques 33%
• Debye-Waller Factor 33%
• Temperature Resolution 33%
• Beamline 33%
• Advanced Photon Source 33%
• Surface Techniques 33%
• Infrared Thermometry 33%
• 3-D Temperature Distribution 33%
• Circuit Failure 33%
• Laboratory Sources 33%
• Large-current-density 33%
• Liquid Anode 33%

Physics

• X Ray Diffraction 100%
• Integrated Circuit 100%
• Temperature Dependence 25%
• Magnetic Resonance 25%
• Optical Resonance 25%
• X Ray 25%
• Temperature Distribution 25%
• Beamline 25%