Temperature aware statistical static timing analysis

Artem Rogachev, Lu Wan, Deming Chen

Research output: Chapter in Book/Report/Conference proceedingConference contribution


With technology scaling, the variability of device parameters continues to increase. This impacts both the performance and the temperature profile of the die turning them into a statistical distribution. To the best of our knowledge, no one has considered the impact of the statistical thermal profile during statistical analysis of the propagation delay. We present a statistical static timing analysis (SSTA) tool which considers this interdependence and produces accurate timing estimation. Our average errors for mean and standard deviation are 0.95% and 3.5% respectively when compared against Monte Carlo simulation. This is a significant improvement over SSTA that assumes a deterministic power profile, whose mean and SD errors are 3.7% and 20.9% respectively. However, when considering 90% performance yield, our algorithm's accuracy improvement was not as significant when compared to the deterministic power case. Thus, if one is concerned with the runtime, a reasonable estimate of the performance yield can be obtained by assuming nominal power. Nevertheless, a full statistical analysis is necessary to achieve maximum accuracy.

Original languageEnglish (US)
Title of host publication2011 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2011
Number of pages8
StatePublished - 2011
Event2011 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2011 - San Jose, CA, United States
Duration: Nov 7 2011Nov 10 2011

Publication series

NameIEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD
ISSN (Print)1092-3152


Other2011 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2011
Country/TerritoryUnited States
CitySan Jose, CA


  • leakage-thermal loop
  • process variations
  • thermal
  • timing analysis

ASJC Scopus subject areas

  • Software
  • Computer Science Applications
  • Computer Graphics and Computer-Aided Design


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