Temperature- and size-dependent characteristics in ultrathin inorganic light-emitting diodes assembled by transfer printing

Tae Il Kim; Soo Hyun Lee; Yuhang Li; Yan Shi; Gunchul Shin; Sung Dan Lee; Yonggang Huang; John A. Rogers; Jae Su Yu

doi:10.1063/1.4863856

Temperature- and size-dependent characteristics in ultrathin inorganic light-emitting diodes assembled by transfer printing

Tae Il Kim, Soo Hyun Lee, Yuhang Li, Yan Shi, Gunchul Shin, Sung Dan Lee, Yonggang Huang, John A. Rogers, Jae Su Yu

Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

Abstract

Favorable temperature- and size-dependent device characteristics in mechanically flexible, thin (∼6.45μm thick), microscale inorganic InGaN/GaN-based light-emitting diodes enable their use as highly efficient, robust devices that are capable of integration on diverse classes of unconventional substrates, including sheets of plastic. Finite element analysis and systematic studies of the operational properties establish important thermal, electrical, and optical considerations for this type of device.

Original language	English (US)
Article number	051901
Journal	Applied Physics Letters
Volume	104
Issue number	5
DOIs	https://doi.org/10.1063/1.4863856
State	Published - Jan 1 2014

ASJC Scopus subject areas

Physics and Astronomy (miscellaneous)

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10.1063/1.4863856

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Temperature- and size-dependent characteristics in ultrathin inorganic light-emitting diodes assembled by transfer printing. / Kim, Tae Il; Hyun Lee, Soo; Li, Yuhang; Shi, Yan; Shin, Gunchul; Lee, Sung Dan; Huang, Yonggang; Rogers, John A.; Su Yu, Jae.

In: Applied Physics Letters, Vol. 104, No. 5, 051901, 01.01.2014.

Research output: Contribution to journal › Article › peer-review

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AU - Huang, Yonggang

AU - Rogers, John A.

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Temperature- and size-dependent characteristics in ultrathin inorganic light-emitting diodes assembled by transfer printing

Abstract

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