TEM study of Bi segregation in the interconnect of eutectic tin-bismuth solder and copper

P. J. Shang, Z. Q. Liu, L. Zhang, D. X. Li, J. K. Shang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The interfacial reaction between eutectic SnBi and Cu was studied by TEM after the sample was reflowed and aged in solid state, respectively. The microstructural evolution at the SnBi/Cu interface during reflowed and solid-state aged process was analyzed. The results show that there are two layers of intermetallic compounds (IMCs), Cu3Sn and Cu6Sn5, located at the interface between solder and Cu after the sample was reflowed. The segregation of Bi at the interface between Cu3Sn and Cu was observed. Furthermore, the segregation of Bi induced the formation of voids at Cu3 Sn/Cu interface during solid-state aging process.

Original languageEnglish (US)
Title of host publicationProceedings of the 2007 8th International Conference on Electronic Packaging Technology, ICEPT
DOIs
StatePublished - 2007
Event2007 8th International Conference on Electronic Packaging Technology, ICEPT - Shanghai, China
Duration: Aug 14 2007Aug 17 2007

Publication series

NameProceedings of the Electronic Packaging Technology Conference, EPTC

Other

Other2007 8th International Conference on Electronic Packaging Technology, ICEPT
CountryChina
CityShanghai
Period8/14/078/17/07

ASJC Scopus subject areas

  • Engineering(all)

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