Technology Development of Integrated Multi-Modal and Flexible Tactile Skin for Robotics Applications

Jonathan Engel, Jack Chen, Xuefeng Wang, Zhifang Fan, Chang Liu, Douglas Jones

Research output: Contribution to conferencePaper

Abstract

We report the development of a multi-modal, flexible tactile sensing skin based on polymer substrates and integrated micromachining technology with increased mechanical robustness relative to silicon tactile devices. This polymer-based tactile skin is very unique because it includes the following sensing modalities beyond surface roughness and contact force measurement: thermal conductivity, hardness, temperature, and its own curvature. These new modalities allow the demonstrated tactile sensors to characterize an object or a contact event in a more comprehensive fashion. Sensing is accomplished via thin film metal gold heaters, nickel RTD's (Resistance Temperature Device), and NiCr (nichrome) strain gauges. Experimental characterization of the sensors' performance and potential for application to robotics are presented.

Original languageEnglish (US)
Pages2359-2364
Number of pages6
StatePublished - Dec 26 2003
Event2003 IEEE/RSJ International Conference on Intelligent Robots and Systems - Las Vegas, NV, United States
Duration: Oct 27 2003Oct 31 2003

Other

Other2003 IEEE/RSJ International Conference on Intelligent Robots and Systems
CountryUnited States
CityLas Vegas, NV
Period10/27/0310/31/03

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ASJC Scopus subject areas

  • Control and Systems Engineering
  • Software
  • Computer Vision and Pattern Recognition
  • Computer Science Applications

Cite this

Engel, J., Chen, J., Wang, X., Fan, Z., Liu, C., & Jones, D. (2003). Technology Development of Integrated Multi-Modal and Flexible Tactile Skin for Robotics Applications. 2359-2364. Paper presented at 2003 IEEE/RSJ International Conference on Intelligent Robots and Systems, Las Vegas, NV, United States.