Tailoring the coefficient of thermal expansion of ternary nickel alloys through compositional control and non-contact measurements

The majority of microelectromechanical systems (MEMS) are made of silicon, however, future applications will be used in extreme environments, especially at elevated temperatures, and require materials with enhanced properties. Use of metal alloys in these applications will require microscale manufacturability, a balance of physical and mechanical properties and dimensional stability. Here, we emphasized dimensional stability by reducing the coefficient of thermal expansion (CTE) and present an optical non-contact method for measuring the thermal expansion of planar thin films. A combinatorial approach was employed to determine the CTE of nickel-molybdenum-tungsten (Ni-Mo-W) sputter deposited films over a range of compositions, and the addition of Mo and W is shown to significantly decrease and provide a route for tailoring the CTE with compositional control. Ni-Mo-W alloys were revealed to have CTE values ranging from 8–12 × 10⁻⁶/°C, matching that of commercial glass substrates that are employed in numerous MEMS devices.