Tailoring of titanium thin film properties in high power pulsed magnetron sputtering

Keyphrases

• Titania Thin Film 100%
• Thin Film Properties 100%
• High Power Pulsed Magnetron Sputtering (HPPMS) 100%
• Ti Film 100%
• Average Power 75%
• Material Properties 50%
• Peak Power 50%
• Target Power 50%
• Ion-to-atom Ratio 50%
• Metal Ions 25%
• Metal Atoms 25%
• High Power 25%
• Deposition Rate 25%
• Large Grain Size 25%
• High-quality Films 25%
• Compressive Stress 25%
• Tensile Stress 25%
• Rough Surface 25%
• Hardmetal 25%
• Specific Applications 25%
• Metal Film 25%
• Film Properties 25%
• Electrical Engineering 25%
• Small Grain Size 25%
• Atom Density 25%
• Power Values 25%
• Gas Temperature 25%
• Plasma Flux 25%
• Physical Vapor Deposition Processes 25%
• Biomedical Instrumentation 25%
• Plasma Composition 25%
• Highly Preferred Orientation 25%
• Constant Peak Power 25%
• Magnetron Sputtering Discharge 25%

Engineering

• Thin Films 100%
• Average Power 100%
• Magnetron 100%
• Film Property 100%
• Peak Power 75%
• Atom Ratio 50%
• Deposited Film 25%
• Biomedical Device 25%
• Growing Film 25%
• Deposition Rate 25%
• Preferred Orientation 25%
• Compressive Stress 25%
• Tensile Stress σ 25%
• Desired Property 25%
• Electrical Engineering 25%
• Physical Vapor Deposition 25%
• Gas Temperature 25%
• Smoother Surface 25%

Material Science

• Film 100%
• Titanium 100%
• Magnetron Sputtering 100%
• Thin Film Property 100%
• Grain Size 40%
• Materials Property 40%
• Density 20%
• Film Growth 20%
• Metal Film 20%
• Ultimate Tensile Strength 20%
• Rough Surface 20%
• Physical Vapor Deposition 20%
• Surface (Surface Science) 20%