Systems and methods of forming power electronic assemblies with cooling channels and integrated electrodes

Paul V. Braun; Julia B Kohanek; Gaurav S Singhal; Shailesh Joshi

Systems and methods of forming power electronic assemblies with cooling channels and integrated electrodes

Paul V. Braun (Inventor), Julia B Kohanek (Inventor), Gaurav S Singhal (Inventor), Shailesh Joshi (Inventor)

Research output: Patent

Abstract

A method for forming an assembly is provided. The method includes depositing a colloidal template onto a substrate, wherein the colloidal template is porous, depositing a metal layer onto and within the colloidal template, depositing a cap structure onto the colloidal template opposite of the substrate, and removing the colloidal template from between the substrate and the cap structure to form a metal inverse opal structure disposed therebetween. The method continues by depositing an electrical isolation layer in contact with the cap structure opposite the metal inverse opal structure, and attaching the electrical isolation layer to a cooling device.

Original language	English (US)
U.S. patent number	11483951
Filing date	11/26/19
State	Published - Oct 25 2022

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title = "Systems and methods of forming power electronic assemblies with cooling channels and integrated electrodes",

abstract = "A method for forming an assembly is provided. The method includes depositing a colloidal template onto a substrate, wherein the colloidal template is porous, depositing a metal layer onto and within the colloidal template, depositing a cap structure onto the colloidal template opposite of the substrate, and removing the colloidal template from between the substrate and the cap structure to form a metal inverse opal structure disposed therebetween. The method continues by depositing an electrical isolation layer in contact with the cap structure opposite the metal inverse opal structure, and attaching the electrical isolation layer to a cooling device.",

author = "Braun, {Paul V.} and Kohanek, {Julia B} and Singhal, {Gaurav S} and Shailesh Joshi",

year = "2022",

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type = "Patent",

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TY - PAT

T1 - Systems and methods of forming power electronic assemblies with cooling channels and integrated electrodes

AU - Braun, Paul V.

AU - Kohanek, Julia B

AU - Singhal, Gaurav S

AU - Joshi, Shailesh

PY - 2022/10/25

Y1 - 2022/10/25

N2 - A method for forming an assembly is provided. The method includes depositing a colloidal template onto a substrate, wherein the colloidal template is porous, depositing a metal layer onto and within the colloidal template, depositing a cap structure onto the colloidal template opposite of the substrate, and removing the colloidal template from between the substrate and the cap structure to form a metal inverse opal structure disposed therebetween. The method continues by depositing an electrical isolation layer in contact with the cap structure opposite the metal inverse opal structure, and attaching the electrical isolation layer to a cooling device.

AB - A method for forming an assembly is provided. The method includes depositing a colloidal template onto a substrate, wherein the colloidal template is porous, depositing a metal layer onto and within the colloidal template, depositing a cap structure onto the colloidal template opposite of the substrate, and removing the colloidal template from between the substrate and the cap structure to form a metal inverse opal structure disposed therebetween. The method continues by depositing an electrical isolation layer in contact with the cap structure opposite the metal inverse opal structure, and attaching the electrical isolation layer to a cooling device.

M3 - Patent

M1 - 11483951

Y2 - 2019/11/26

ER -

Systems and methods of forming power electronic assemblies with cooling channels and integrated electrodes

Abstract

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