System-level characterization of modal signaling for high-density off-chip interconnects

Pavle Milosevic; Jose E Schutt-Aine

doi:10.1109/EDAPS.2011.6213748

System-level characterization of modal signaling for high-density off-chip interconnects

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

In high-speed chip-to-chip single-ended signaling links, far-end crosstalk presents one of the dominant noise sources, limiting the link performance. Diagonalizing the channel using modal decomposition has been proposed to mitigate the crosstalk. However, a practical circuit implementation of such a transceiver system will unavoidably deviate from the ideal (crosstalk-free) eigenvalue decomposition. In this paper, the impact of modal encoder/decoder coefficient quantization, random common and uncorrelated noise on signal integrity is analyzed in terms of system-level performance metrics, SNR and BER. Also discussed is the optimal selection of decoder coefficients with respect to the input-referred noise at the receiver.

Original language	English (US)
Title of host publication	2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011
DOIs	https://doi.org/10.1109/EDAPS.2011.6213748
State	Published - Dec 1 2011
Event	2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011 - Hanzhou, China Duration: Dec 12 2011 → Dec 14 2011

Publication series

Name	2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011

Other

Other	2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011
Country	China
City	Hanzhou
Period	12/12/11 → 12/14/11

Keywords

Crosstalk mitigation
highspeed signaling
modal decomposition

ASJC Scopus subject areas

Electrical and Electronic Engineering

Access to Document

10.1109/EDAPS.2011.6213748

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System-level characterization of modal signaling for high-density off-chip interconnects. / Milosevic, Pavle; Schutt-Aine, Jose E.

2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011. 2011. 6213748 (2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Milosevic, P & Schutt-Aine, JE 2011, System-level characterization of modal signaling for high-density off-chip interconnects. in 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011., 6213748, 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011, 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011, Hanzhou, China, 12/12/11. https://doi.org/10.1109/EDAPS.2011.6213748

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