System-level characterization of modal signaling for high-density off-chip interconnects

Pavle Milosevic, Jose E Schutt-Aine

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In high-speed chip-to-chip single-ended signaling links, far-end crosstalk presents one of the dominant noise sources, limiting the link performance. Diagonalizing the channel using modal decomposition has been proposed to mitigate the crosstalk. However, a practical circuit implementation of such a transceiver system will unavoidably deviate from the ideal (crosstalk-free) eigenvalue decomposition. In this paper, the impact of modal encoder/decoder coefficient quantization, random common and uncorrelated noise on signal integrity is analyzed in terms of system-level performance metrics, SNR and BER. Also discussed is the optimal selection of decoder coefficients with respect to the input-referred noise at the receiver.

Original languageEnglish (US)
Title of host publication2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011
DOIs
StatePublished - Dec 1 2011
Event2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011 - Hanzhou, China
Duration: Dec 12 2011Dec 14 2011

Publication series

Name2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011

Other

Other2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011
CountryChina
CityHanzhou
Period12/12/1112/14/11

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Keywords

  • Crosstalk mitigation
  • highspeed signaling
  • modal decomposition

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Milosevic, P., & Schutt-Aine, J. E. (2011). System-level characterization of modal signaling for high-density off-chip interconnects. In 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011 [6213748] (2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011). https://doi.org/10.1109/EDAPS.2011.6213748