Surace-Enhanced Two-Phase Cold Plate Designs for High Power Dissipation in Data Centers

Keyphrases

• Air Cooling 33%
• Aluminum Fins 33%
• Channel Width 66%
• Cold Plate 33%
• Cold Plate Design 100%
• Coolant 66%
• Coolant Temperature 33%
• Dry Cooling 33%
• Electrical Discharge Machining 33%
• Energy Efficient 33%
• Evaporator 33%
• Fin Height 66%
• Fin Plate 33%
• Fin Width 66%
• Flow Boiling 33%
• Flow Boiling Heat Transfer Coefficient 33%
• Heat Capture 33%
• Heat Load 100%
• Heat Rejection 33%
• Heat Reuse 33%
• High Aspect Ratio 33%
• High Energy Dissipation 100%
• High Performance 33%
• High Power Density 33%
• Low Profile 33%
• Low Water 33%
• Management Approach 33%
• Microchannel Evaporator 33%
• Multichip Modules 100%
• Popular Architecture 33%
• Power Density 66%
• R1233zd(E) 33%
• Refrigerant 33%
• Refrigerant Flow 66%
• Rewetting 33%
• Surface Structuring 66%
• Thermal Management 33%
• Thermal Resistance 100%
• Two-phase Cooling 66%
• Water Use 33%
• Wickability 33%

Engineering

• Aluminum 100%
• Boiling Heat Transfer Coefficient 33%
• Cooling Air 33%
• Electric Discharge Machining 33%
• Electrical Discharge 33%
• Energy Dissipation 100%
• Energy Performance 33%
• Evaporator 66%
• Fin Height 66%
• Fin Width 66%
• Heat Rejection 33%
• Heat Resistance 100%
• High Aspect Ratio 33%
• Microchannel 66%
• Power Density 100%
• Thermal Load 100%
• Water Usage 33%

Material Science

• Aluminum 100%
• Coolant 100%
• Density 100%
• Electrical Discharge Machining 33%
• Heat Resistance 100%
• Heating Load 100%
• Nucleation 33%
• Thermal Management 33%