Substrate modeling and lumped substrate resistance extraction for CMOS ESD/latchup circuit simulation

Tong Li, Ching Han Tsai, Elyse Rosenbaum, Sung Mo Kang

Research output: Contribution to journalConference articlepeer-review

Abstract

Due to interactions through the common silicon substrate, the layout and placement of devices and substrate contacts can have significant impacts on a circuit's ESD (Electrostatic Discharge) and latchup behavior in CMOS technologies. Proper substrate modeling is thus required for circuit-level simulation to predict the circuit's ESD performance and latchup immunity. In this work we propose a new substrate resistance network model, and develop a novel substrate resistance extraction method that accurately calculates the distribution of injection current into the substrate during ESD or latchup events. With the proposed substrate model and resistance extraction, we can capture the three-dimensional layout parasitics in the circuit as well as the vertical substrate doping profile, and simulate these effects on circuit behavior at the circuit-level accurately. The usefulness of this work for layout optimization is demonstrated with an industrial circuit example.

Original languageEnglish (US)
Pages (from-to)549-554
Number of pages6
JournalProceedings - Design Automation Conference
DOIs
StatePublished - 1999
Externally publishedYes
EventProceedings of the 1999 36th Annual Design Automation Conference (DAC) - New Orleans, LA, USA
Duration: Jun 21 1999Jun 25 1999

ASJC Scopus subject areas

  • Hardware and Architecture
  • Control and Systems Engineering

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