Stretchability of encapsulated electronics

J. Wu; Z. J. Liu; J. Song; Y. Huang; K. C. Hwang; Y. W. Zhang; J. A. Rogers

doi:10.1063/1.3624848

Stretchability of encapsulated electronics

J. Wu, Z. J. Liu, J. Song, Y. Huang, K. C. Hwang, Y. W. Zhang, J. A. Rogers

Research output: Contribution to journal › Article › peer-review

Abstract

Stretchable and flexible electronics offer the performance of conventional wafer-based systems but can be stretched like a rubber band, twisted like a rope, and bent over a pencil. Such a technology offers new application opportunities, in areas of surgical and diagnostic implements that naturally integrate with the human body to provide advanced capabilities, to curvilinear devices such as hemispherical eyeball cameras. In practice, stretchable and flexible electronic systems require encapsulation layers to provide mechanical and environmental protection. This paper establishes a simple, analytical model for the optimal design of encapsulation.

Original language	English (US)
Article number	061911
Journal	Applied Physics Letters
Volume	99
Issue number	6
DOIs	https://doi.org/10.1063/1.3624848
State	Published - Aug 8 2011
Externally published	Yes

ASJC Scopus subject areas

Physics and Astronomy (miscellaneous)

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10.1063/1.3624848

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title = "Stretchability of encapsulated electronics",

abstract = "Stretchable and flexible electronics offer the performance of conventional wafer-based systems but can be stretched like a rubber band, twisted like a rope, and bent over a pencil. Such a technology offers new application opportunities, in areas of surgical and diagnostic implements that naturally integrate with the human body to provide advanced capabilities, to curvilinear devices such as hemispherical eyeball cameras. In practice, stretchable and flexible electronic systems require encapsulation layers to provide mechanical and environmental protection. This paper establishes a simple, analytical model for the optimal design of encapsulation.",

author = "J. Wu and Liu, {Z. J.} and J. Song and Y. Huang and Hwang, {K. C.} and Zhang, {Y. W.} and Rogers, {J. A.}",

note = "Funding Information: J.W. and Z.J.L. contribute equally to this work. Y.H. and J.A.R. acknowledge the supports from the NSF (Grant Nos. CMMI-0845294, ECCS-0824129, and OISE-1043143). Y.H. and K.C.H. acknowledge the supports from the NSFC and Ministry of Education of China. J.S. acknowledges the support from the NSF (Grant No. OISE1043161).",

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AU - Wu, J.

AU - Liu, Z. J.

AU - Song, J.

AU - Huang, Y.

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AU - Zhang, Y. W.

AU - Rogers, J. A.

N1 - Funding Information: J.W. and Z.J.L. contribute equally to this work. Y.H. and J.A.R. acknowledge the supports from the NSF (Grant Nos. CMMI-0845294, ECCS-0824129, and OISE-1043143). Y.H. and K.C.H. acknowledge the supports from the NSFC and Ministry of Education of China. J.S. acknowledges the support from the NSF (Grant No. OISE1043161).

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Stretchability of encapsulated electronics

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