Abstract
In this study dynamic mechanical analysis (DMA) was carried out on 3501-6 epoxy resin at several different cure states. Specimens were cured at different temperatures to obtain a range of degree of cure from 0.57 to 0.98. These specimens were then tested to acquire stress relaxation modulus over a wide temperature range. Master curves and shift functions are obtained by time-temperature superposition for each degree of cure case. Dynamic mechanical analysis with fixed frequency was also performed to obtain glass transition temperatures for each degree of cure case. The results show that the cure state has a profound effect on stress relaxation behavior. The relaxation time and glass transition temperature were shown to develop in a similar fashion.
| Original language | English (US) |
|---|---|
| Title of host publication | ASME Materials Division |
| Editors | M.C. Boyce |
| Publisher | ASME |
| Pages | 43-56 |
| Number of pages | 14 |
| Volume | 69-1 |
| State | Published - 1995 |
| Event | Proceedings of the 1995 ASME International Mechanical Congress and Exposition - San Francisco, CA, USA Duration: Nov 12 1995 → Nov 17 1995 |
Other
| Other | Proceedings of the 1995 ASME International Mechanical Congress and Exposition |
|---|---|
| City | San Francisco, CA, USA |
| Period | 11/12/95 → 11/17/95 |
ASJC Scopus subject areas
- General Engineering