Skip to main navigation
Skip to search
Skip to main content
Illinois Experts Home
LOGIN & Help
Home
Profiles
Research units
Research & Scholarship
Datasets
Honors
Press/Media
Activities
Search by expertise, name or affiliation
Stress relaxation behavior of 3501-6 epoxy resin during cure
Yeong K. Kim, Scott R. White
Aerospace Engineering
Research output
:
Contribution to journal
›
Article
›
peer-review
Overview
Fingerprint
Fingerprint
Dive into the research topics of 'Stress relaxation behavior of 3501-6 epoxy resin during cure'. Together they form a unique fingerprint.
Sort by
Weight
Alphabetically
Keyphrases
Epoxy Resin
100%
Stress Relaxation
100%
Relaxation Modulus
66%
Epoxy
33%
Relaxation Behavior
33%
Shifting Method
33%
Degree of Cure
33%
Viscoelastic Properties
33%
Master Curve
33%
Liquid-solid
33%
Gelation
33%
Time-based
33%
Constitutive Model
33%
Stress Relaxation Time
33%
Thermosetting Polymers
33%
Reduced Time
33%
Original Model
33%
Exponential Series
33%
Prony
33%
Dynamic Mechanical Analyzer
33%
Engineering
Stress Relaxation
100%
Relaxation Modulus
50%
Relaxation Time
25%
Data Show
25%
Master Curve
25%
Gelation
25%
Constitutive Model
25%
Dynamic Mechanical Analyser
25%
Material Science
Stress Relaxation
100%
Epoxy
100%
Thermoset Plastics
25%