Stress-induced wrinkling of sputtered SiO 2 films on polymethylmethacrylate

Justin R. Serrano, Qinqin Xu, David G. Cahill

Research output: Contribution to journalArticlepeer-review


Compressively stressed SiO2 films are deposited by rf magnetron sputtering onto polymethylmethacrylate- (PMMA) coated Si substrates. The oxide film roughens by wrinkling during deposition; wrinkling is enabled by the viscous flow of the PMMA layer. The nanoscale lateral length scale of the wrinkling, ∼120 nm, is established during the first few nanometers of film deposition and is controlled by the thickness and stress of the SiO2 film at the onset of the instability. Continued deposition of SiO2 leads to a rapid increase and then saturation of the rms roughness at ∼5 nm.

Original languageEnglish (US)
Pages (from-to)324-327
Number of pages4
JournalJournal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Issue number2
StatePublished - Mar 2006
Externally publishedYes

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films


Dive into the research topics of 'Stress-induced wrinkling of sputtered SiO 2 films on polymethylmethacrylate'. Together they form a unique fingerprint.

Cite this