Stress free wafer bonded GaAs-on-Si photonic devices and circuits

Keyphrases

• Gallium Arsenide 100%
• Wafer 100%
• Bonding Process 100%
• Stress-free 100%
• Photonic Devices 100%
• Photonic Circuits 100%
• GaAs on Si 100%
• Si Photonics 100%
• Low-temperature Bonding 100%
• High Temperature 50%
• Surface Morphology 50%
• Debonding 50%
• Si Substrate 50%
• Smooth Surface 50%
• Chemical Mechanical Polishing 50%
• Vertical-cavity Surface-emitting Laser (VCSEL) 50%
• GaAs Wafer 50%
• GaAs Devices 50%
• Device Materials 50%
• Stress Problems 50%
• GaAs Substrate Removal 50%
• Fusion Bonding 50%

Material Science

• Optical Device 100%
• Electronic Circuit 100%
• Gallium Arsenide 100%
• Chemical Mechanical Planarization 16%
• Surface Morphology 16%
• Debonding 16%