Stress assisted controlled fabrication of nano channels and their flow characteristics

Engineering

• Flow Characteristics 100%
• Flow Rate 50%
• Flow Velocity 50%
• Fluid Flow 50%
• Initiation of Crack 50%
• Interfacial Energy 50%
• Lithography 50%
• Narrow Channel 50%
• Proportionality Constant 50%
• Residual Stress 50%
• Silicon Dioxide 50%
• Silicon Substrate 100%
• Square Root 50%
• Stress Raiser 50%
• Thin Films 50%

Keyphrases

• Capillary-driven 25%
• Contact Angle 25%
• Controlled Fabrication 100%
• Controlled Initiation 25%
• Crack Initiation 25%
• Deep RIE 25%
• Flow Characteristics 100%
• Fluid Flow 25%
• Meniscus 25%
• Nanochannel 100%
• Nanoimprint Lithography 25%
• Oxide Stress 25%
• Proportionality Constant 25%
• Residual Stress 25%
• Silicon Dioxide 25%
• Silicon Substrate 50%
• Square Root 25%
• Stress Raiser 25%
• Stress-driven 100%
• Surface Energy 25%