TY - GEN
T1 - Stochastic LIM for transient simulation of circuits with uncertainties
AU - Chen, Xu
AU - Qiu, Michael
AU - Schutt-Ainé, José E.
AU - Cangellaris, Andreas C.
N1 - Publisher Copyright:
© 2014 IEEE.
PY - 2014
Y1 - 2014
N2 - This paper presents a stochastic Latency Insertion Method formulation using the generalized Polynomial Chaos framework. The proposed method enables fast simulation of circuits with uncertain elements. When the mean and variance of circuit elements are provided in the netlist, this method can calculate the statistics of the transient response to arbitrary sources using an augmented state space system. Due to the underlying leapfrogging finite difference scheme, the computational complexity grows only linearly with the number of terms in the expansion. The formulation is verified using Monte Carlo on a random resistor network with inserted latencies.
AB - This paper presents a stochastic Latency Insertion Method formulation using the generalized Polynomial Chaos framework. The proposed method enables fast simulation of circuits with uncertain elements. When the mean and variance of circuit elements are provided in the netlist, this method can calculate the statistics of the transient response to arbitrary sources using an augmented state space system. Due to the underlying leapfrogging finite difference scheme, the computational complexity grows only linearly with the number of terms in the expansion. The formulation is verified using Monte Carlo on a random resistor network with inserted latencies.
UR - http://www.scopus.com/inward/record.url?scp=84937147545&partnerID=8YFLogxK
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U2 - 10.1109/EPEPS.2014.7103585
DO - 10.1109/EPEPS.2014.7103585
M3 - Conference contribution
AN - SCOPUS:84937147545
T3 - 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014
SP - 29
EP - 32
BT - 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 23rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014
Y2 - 26 October 2014 through 29 October 2014
ER -