Statistical analysis of fiber weave effect over differential microstrips on printed circuit boards

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Fiberglass and epoxy-based dielectric substrates are ubiquitous in manufactured printed circuit boards. Their construction usually involves various woven fiberglass fabrics saturated with epoxy resin. These two materials have different electrical properties, hence as data rate increases and structure feature size decreases, the fiber weaves in the substrates can have profound impacts on the effective dielectric constants of printed circuit boards, which can cause unforeseen degradations in signal integrity. This paper proposes a systematic way of modeling fiber weave effect on high-speed interconnects over low-cost substrates, and also presents a statistical analysis of the impact of fiber weave effect on intra-pair skew of differential microstrip lines.

Original languageEnglish (US)
Title of host publication2014 18th IEEE Workshop on Signal and Power Integrity, SPI 2014 - Proceedings
PublisherIEEE Computer Society
ISBN (Print)9781479935994
DOIs
StatePublished - Jan 1 2014
Event18th IEEE Workshop on Signal and Power Integrity, SPI 2014 - Ghent, Belgium
Duration: May 11 2014May 14 2014

Publication series

Name2014 18th IEEE Workshop on Signal and Power Integrity, SPI 2014 - Proceedings

Other

Other18th IEEE Workshop on Signal and Power Integrity, SPI 2014
CountryBelgium
CityGhent
Period5/11/145/14/14

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ASJC Scopus subject areas

  • Signal Processing

Cite this

Zhang, T., Chen, X., Schutt-Aine, J. E., & Cangellaris, A. C. (2014). Statistical analysis of fiber weave effect over differential microstrips on printed circuit boards. In 2014 18th IEEE Workshop on Signal and Power Integrity, SPI 2014 - Proceedings [6844540] (2014 18th IEEE Workshop on Signal and Power Integrity, SPI 2014 - Proceedings). IEEE Computer Society. https://doi.org/10.1109/SaPIW.2014.6844540