Statistical analysis of fiber weave effect over differential microstrips on printed circuit boards

Tong Zhang; Xu Chen; José E. Schutt-Ainé; Andreas C. Cangellaris

doi:10.1109/SaPIW.2014.6844540

Statistical analysis of fiber weave effect over differential microstrips on printed circuit boards

Tong Zhang, Xu Chen, José E. Schutt-Ainé, Andreas C. Cangellaris

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Fiberglass and epoxy-based dielectric substrates are ubiquitous in manufactured printed circuit boards. Their construction usually involves various woven fiberglass fabrics saturated with epoxy resin. These two materials have different electrical properties, hence as data rate increases and structure feature size decreases, the fiber weaves in the substrates can have profound impacts on the effective dielectric constants of printed circuit boards, which can cause unforeseen degradations in signal integrity. This paper proposes a systematic way of modeling fiber weave effect on high-speed interconnects over low-cost substrates, and also presents a statistical analysis of the impact of fiber weave effect on intra-pair skew of differential microstrip lines.

Original language	English (US)
Title of host publication	2014 18th IEEE Workshop on Signal and Power Integrity, SPI 2014 - Proceedings
Publisher	IEEE Computer Society
ISBN (Print)	9781479935994
DOIs	https://doi.org/10.1109/SaPIW.2014.6844540
State	Published - 2014
Event	18th IEEE Workshop on Signal and Power Integrity, SPI 2014 - Ghent, Belgium Duration: May 11 2014 → May 14 2014

Publication series

Name	2014 18th IEEE Workshop on Signal and Power Integrity, SPI 2014 - Proceedings

Other

Other	18th IEEE Workshop on Signal and Power Integrity, SPI 2014
Country/Territory	Belgium
City	Ghent
Period	5/11/14 → 5/14/14

ASJC Scopus subject areas

Signal Processing

Online availability

10.1109/SaPIW.2014.6844540

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Zhang, T., Chen, X., Schutt-Ainé, J. E., & Cangellaris, A. C. (2014). Statistical analysis of fiber weave effect over differential microstrips on printed circuit boards. In 2014 18th IEEE Workshop on Signal and Power Integrity, SPI 2014 - Proceedings Article 6844540 (2014 18th IEEE Workshop on Signal and Power Integrity, SPI 2014 - Proceedings). IEEE Computer Society. https://doi.org/10.1109/SaPIW.2014.6844540

Statistical analysis of fiber weave effect over differential microstrips on printed circuit boards. / Zhang, Tong; Chen, Xu ; Schutt-Ainé, José E. et al.
2014 18th IEEE Workshop on Signal and Power Integrity, SPI 2014 - Proceedings. IEEE Computer Society, 2014. 6844540 (2014 18th IEEE Workshop on Signal and Power Integrity, SPI 2014 - Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Zhang, T, Chen, X , Schutt-Ainé, JE & Cangellaris, AC 2014, Statistical analysis of fiber weave effect over differential microstrips on printed circuit boards. in 2014 18th IEEE Workshop on Signal and Power Integrity, SPI 2014 - Proceedings., 6844540, 2014 18th IEEE Workshop on Signal and Power Integrity, SPI 2014 - Proceedings, IEEE Computer Society, 18th IEEE Workshop on Signal and Power Integrity, SPI 2014, Ghent, Belgium, 5/11/14. https://doi.org/10.1109/SaPIW.2014.6844540

Zhang T, Chen X , Schutt-Ainé JE , Cangellaris AC. Statistical analysis of fiber weave effect over differential microstrips on printed circuit boards. In 2014 18th IEEE Workshop on Signal and Power Integrity, SPI 2014 - Proceedings. IEEE Computer Society. 2014. 6844540. (2014 18th IEEE Workshop on Signal and Power Integrity, SPI 2014 - Proceedings). doi: 10.1109/SaPIW.2014.6844540

@inproceedings{77a787fddb584a61afc8598beaf7d2fa,

title = "Statistical analysis of fiber weave effect over differential microstrips on printed circuit boards",

abstract = "Fiberglass and epoxy-based dielectric substrates are ubiquitous in manufactured printed circuit boards. Their construction usually involves various woven fiberglass fabrics saturated with epoxy resin. These two materials have different electrical properties, hence as data rate increases and structure feature size decreases, the fiber weaves in the substrates can have profound impacts on the effective dielectric constants of printed circuit boards, which can cause unforeseen degradations in signal integrity. This paper proposes a systematic way of modeling fiber weave effect on high-speed interconnects over low-cost substrates, and also presents a statistical analysis of the impact of fiber weave effect on intra-pair skew of differential microstrip lines.",

author = "Tong Zhang and Xu Chen and Schutt-Ain{\'e}, {Jos{\'e} E.} and Cangellaris, {Andreas C.}",

year = "2014",

doi = "10.1109/SaPIW.2014.6844540",

language = "English (US)",

isbn = "9781479935994",

series = "2014 18th IEEE Workshop on Signal and Power Integrity, SPI 2014 - Proceedings",

publisher = "IEEE Computer Society",

booktitle = "2014 18th IEEE Workshop on Signal and Power Integrity, SPI 2014 - Proceedings",

note = "18th IEEE Workshop on Signal and Power Integrity, SPI 2014 ; Conference date: 11-05-2014 Through 14-05-2014",

}

TY - GEN

T1 - Statistical analysis of fiber weave effect over differential microstrips on printed circuit boards

AU - Zhang, Tong

AU - Chen, Xu

AU - Schutt-Ainé, José E.

AU - Cangellaris, Andreas C.

PY - 2014

Y1 - 2014

N2 - Fiberglass and epoxy-based dielectric substrates are ubiquitous in manufactured printed circuit boards. Their construction usually involves various woven fiberglass fabrics saturated with epoxy resin. These two materials have different electrical properties, hence as data rate increases and structure feature size decreases, the fiber weaves in the substrates can have profound impacts on the effective dielectric constants of printed circuit boards, which can cause unforeseen degradations in signal integrity. This paper proposes a systematic way of modeling fiber weave effect on high-speed interconnects over low-cost substrates, and also presents a statistical analysis of the impact of fiber weave effect on intra-pair skew of differential microstrip lines.

AB - Fiberglass and epoxy-based dielectric substrates are ubiquitous in manufactured printed circuit boards. Their construction usually involves various woven fiberglass fabrics saturated with epoxy resin. These two materials have different electrical properties, hence as data rate increases and structure feature size decreases, the fiber weaves in the substrates can have profound impacts on the effective dielectric constants of printed circuit boards, which can cause unforeseen degradations in signal integrity. This paper proposes a systematic way of modeling fiber weave effect on high-speed interconnects over low-cost substrates, and also presents a statistical analysis of the impact of fiber weave effect on intra-pair skew of differential microstrip lines.

UR - http://www.scopus.com/inward/record.url?scp=84904512275&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84904512275&partnerID=8YFLogxK

U2 - 10.1109/SaPIW.2014.6844540

DO - 10.1109/SaPIW.2014.6844540

M3 - Conference contribution

AN - SCOPUS:84904512275

SN - 9781479935994

T3 - 2014 18th IEEE Workshop on Signal and Power Integrity, SPI 2014 - Proceedings

BT - 2014 18th IEEE Workshop on Signal and Power Integrity, SPI 2014 - Proceedings

PB - IEEE Computer Society

T2 - 18th IEEE Workshop on Signal and Power Integrity, SPI 2014

Y2 - 11 May 2014 through 14 May 2014

ER -

Statistical analysis of fiber weave effect over differential microstrips on printed circuit boards

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