Stable bin packing of non-convex 3D objects with a robot manipulator

Fan Wang, Kris Hauser

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Recent progress in the field of robotic manipulation has generated interest in fully automatic object packing in warehouses. This paper proposes a formulation of the packing problem that is tailored to the automated warehousing domain. Besides minimizing waste space inside a container, the problem requires stability of the object pile during packing and the feasibility of the robot motion executing the placement plans. To address this problem, a set of constraints are formulated, and a constructive packing pipeline is proposed to solve these constraints. The pipeline is able to pack geometrically complex, non-convex objects while satisfying stability and robot packability constraints. In particular, a new 3D positioning heuristic called Heightmap-Minimization heuristic is proposed, and heightmaps are used to speed up the search. Experimental evaluation of the method is conducted with a realistic physical simulator on a dataset of scanned real-world items, demonstrating stable and high-quality packing plans compared with other 3D packing methods.

Original languageEnglish (US)
Title of host publication2019 International Conference on Robotics and Automation, ICRA 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages8698-8704
Number of pages7
ISBN (Electronic)9781538660263
DOIs
StatePublished - May 2019
Externally publishedYes
Event2019 International Conference on Robotics and Automation, ICRA 2019 - Montreal, Canada
Duration: May 20 2019May 24 2019

Publication series

NameProceedings - IEEE International Conference on Robotics and Automation
ISSN (Print)1050-4729

Conference

Conference2019 International Conference on Robotics and Automation, ICRA 2019
Country/TerritoryCanada
CityMontreal
Period5/20/195/24/19

ASJC Scopus subject areas

  • Software
  • Control and Systems Engineering
  • Electrical and Electronic Engineering
  • Artificial Intelligence

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