Spin-dependent thermal transport perpendicular to the planes of Co/Cu multilayers

Johannes Kimling, R. B. Wilson, Karsten Rott, Judith Kimling, Günter Reiss, David G. Cahill

Research output: Contribution to journalArticle

Abstract

We report measurements of the cross-plane thermal conductivity of periodic Co/Cu multilayers using time-domain thermoreflectance. The cross-plane thermal conductivity increases from ∼ 18 Wm-1K-1 at remanence to ∼ 32 Wm-1K-1 at saturation fields. This giant magnetothermal resistance (GMTR) effect is consistent with predictions based on the Wiedemann-Franz law. We discuss the role of a spin-dependent temperature, known as spin heat accumulation, in GMTR experiments and develop a three-temperature model capable of predicting the time evolution of the temperatures of majority-spin electrons, minority-spin electrons, and phonons subsequent to pulsed laser heating.

Original languageEnglish (US)
Article number144405
JournalPhysical Review B - Condensed Matter and Materials Physics
Volume91
Issue number14
DOIs
StatePublished - Apr 7 2015

Fingerprint

Multilayers
electron spin
Thermal conductivity
thermal conductivity
Laser heating
Electrons
Remanence
laser heating
minorities
remanence
Phonons
Pulsed lasers
Temperature
temperature
pulsed lasers
phonons
saturation
heat
predictions
Hot Temperature

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics

Cite this

Spin-dependent thermal transport perpendicular to the planes of Co/Cu multilayers. / Kimling, Johannes; Wilson, R. B.; Rott, Karsten; Kimling, Judith; Reiss, Günter; Cahill, David G.

In: Physical Review B - Condensed Matter and Materials Physics, Vol. 91, No. 14, 144405, 07.04.2015.

Research output: Contribution to journalArticle

Kimling, Johannes ; Wilson, R. B. ; Rott, Karsten ; Kimling, Judith ; Reiss, Günter ; Cahill, David G. / Spin-dependent thermal transport perpendicular to the planes of Co/Cu multilayers. In: Physical Review B - Condensed Matter and Materials Physics. 2015 ; Vol. 91, No. 14.
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