| Original language | English (US) |
|---|---|
| Pages (from-to) | 6-8 |
| Number of pages | 3 |
| Journal | IEEE Micro |
| Volume | 45 |
| Issue number | 1 |
| DOIs | |
| State | Published - 2025 |
ASJC Scopus subject areas
- Software
- Hardware and Architecture
- Electrical and Electronic Engineering
Special Issue on Interconnects for Chiplet Integration Technologies
Debendra Das Sharma, Nam Sung Kim
Research output: Contribution to journal › Editorial › peer-review