TY - GEN
T1 - Spacer-is-dielectric-compliant detailed routing for self-aligned double patterning lithography
AU - Du, Yuelin
AU - Ma, Qiang
AU - Song, Hua
AU - Shiely, James
AU - Luk-Pat, Gerard
AU - Miloslavsky, Alexander
AU - Wong, Martin D.F.
PY - 2013
Y1 - 2013
N2 - Self-aligned double patterning (SADP) lithography is a leading technology for 10nm node Metal layer fabrication. In order to achieve successful decomposition, SADP-compliant design becomes a necessity. Spacer-Is-Dielectric (SID) is the most popular flavor of SADP with higher flexibility in de- sign. This paper makes a careful study on the challenges for SID-compliant detailed routing and proposes a graph model to capture the decomposition violations and SID intrinsic residue issues. Then a negotiated congestion based scheme is adopted to solve the overall routing problem. The proposed SID-compliant detailed routing algorithm simultaneously assigns colors to the routed wires, which provides valuable information guiding SID decomposition. In addition, if one pin has multiple candidate locations, the optimal one will be automatically determined during detailed routing. The decomposability of the conict-free routing layers produced by our detailed router is verified by a commercial SADP decomposition tool.
AB - Self-aligned double patterning (SADP) lithography is a leading technology for 10nm node Metal layer fabrication. In order to achieve successful decomposition, SADP-compliant design becomes a necessity. Spacer-Is-Dielectric (SID) is the most popular flavor of SADP with higher flexibility in de- sign. This paper makes a careful study on the challenges for SID-compliant detailed routing and proposes a graph model to capture the decomposition violations and SID intrinsic residue issues. Then a negotiated congestion based scheme is adopted to solve the overall routing problem. The proposed SID-compliant detailed routing algorithm simultaneously assigns colors to the routed wires, which provides valuable information guiding SID decomposition. In addition, if one pin has multiple candidate locations, the optimal one will be automatically determined during detailed routing. The decomposability of the conict-free routing layers produced by our detailed router is verified by a commercial SADP decomposition tool.
KW - SADP
KW - SID-compliant detailed routing
UR - http://www.scopus.com/inward/record.url?scp=84879861837&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84879861837&partnerID=8YFLogxK
U2 - 10.1145/2463209.2488848
DO - 10.1145/2463209.2488848
M3 - Conference contribution
AN - SCOPUS:84879861837
SN - 9781450320719
T3 - Proceedings - Design Automation Conference
BT - Proceedings of the 50th Annual Design Automation Conference, DAC 2013
T2 - 50th Annual Design Automation Conference, DAC 2013
Y2 - 29 May 2013 through 7 June 2013
ER -