Spacer-is-dielectric-compliant detailed routing for self-aligned double patterning lithography

Yuelin Du, Qiang Ma, Hua Song, James Shiely, Gerard Luk-Pat, Alexander Miloslavsky, Martin D F Wong

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Self-aligned double patterning (SADP) lithography is a leading technology for 10nm node Metal layer fabrication. In order to achieve successful decomposition, SADP-compliant design becomes a necessity. Spacer-Is-Dielectric (SID) is the most popular flavor of SADP with higher flexibility in de- sign. This paper makes a careful study on the challenges for SID-compliant detailed routing and proposes a graph model to capture the decomposition violations and SID intrinsic residue issues. Then a negotiated congestion based scheme is adopted to solve the overall routing problem. The proposed SID-compliant detailed routing algorithm simultaneously assigns colors to the routed wires, which provides valuable information guiding SID decomposition. In addition, if one pin has multiple candidate locations, the optimal one will be automatically determined during detailed routing. The decomposability of the conict-free routing layers produced by our detailed router is verified by a commercial SADP decomposition tool.

Original languageEnglish (US)
Title of host publicationProceedings of the 50th Annual Design Automation Conference, DAC 2013
DOIs
StatePublished - Jul 12 2013
Event50th Annual Design Automation Conference, DAC 2013 - Austin, TX, United States
Duration: May 29 2013Jun 7 2013

Publication series

NameProceedings - Design Automation Conference
ISSN (Print)0738-100X

Other

Other50th Annual Design Automation Conference, DAC 2013
CountryUnited States
CityAustin, TX
Period5/29/136/7/13

Fingerprint

Double Patterning
Lithography
Routing
Decomposition
Decompose
Decomposability
Flavors
Routing Problem
Graph Model
Routing algorithms
Routing Algorithm
Router
Routers
Congestion
Assign
Fabrication
Metals
Flexibility
Wire
Color

Keywords

  • SADP
  • SID-compliant detailed routing

ASJC Scopus subject areas

  • Computer Science Applications
  • Control and Systems Engineering
  • Electrical and Electronic Engineering
  • Modeling and Simulation

Cite this

Du, Y., Ma, Q., Song, H., Shiely, J., Luk-Pat, G., Miloslavsky, A., & Wong, M. D. F. (2013). Spacer-is-dielectric-compliant detailed routing for self-aligned double patterning lithography. In Proceedings of the 50th Annual Design Automation Conference, DAC 2013 [93] (Proceedings - Design Automation Conference). https://doi.org/10.1145/2463209.2488848

Spacer-is-dielectric-compliant detailed routing for self-aligned double patterning lithography. / Du, Yuelin; Ma, Qiang; Song, Hua; Shiely, James; Luk-Pat, Gerard; Miloslavsky, Alexander; Wong, Martin D F.

Proceedings of the 50th Annual Design Automation Conference, DAC 2013. 2013. 93 (Proceedings - Design Automation Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Du, Y, Ma, Q, Song, H, Shiely, J, Luk-Pat, G, Miloslavsky, A & Wong, MDF 2013, Spacer-is-dielectric-compliant detailed routing for self-aligned double patterning lithography. in Proceedings of the 50th Annual Design Automation Conference, DAC 2013., 93, Proceedings - Design Automation Conference, 50th Annual Design Automation Conference, DAC 2013, Austin, TX, United States, 5/29/13. https://doi.org/10.1145/2463209.2488848
Du Y, Ma Q, Song H, Shiely J, Luk-Pat G, Miloslavsky A et al. Spacer-is-dielectric-compliant detailed routing for self-aligned double patterning lithography. In Proceedings of the 50th Annual Design Automation Conference, DAC 2013. 2013. 93. (Proceedings - Design Automation Conference). https://doi.org/10.1145/2463209.2488848
Du, Yuelin ; Ma, Qiang ; Song, Hua ; Shiely, James ; Luk-Pat, Gerard ; Miloslavsky, Alexander ; Wong, Martin D F. / Spacer-is-dielectric-compliant detailed routing for self-aligned double patterning lithography. Proceedings of the 50th Annual Design Automation Conference, DAC 2013. 2013. (Proceedings - Design Automation Conference).
@inproceedings{341255594b0b4d1eb12359b0d9c9ff35,
title = "Spacer-is-dielectric-compliant detailed routing for self-aligned double patterning lithography",
abstract = "Self-aligned double patterning (SADP) lithography is a leading technology for 10nm node Metal layer fabrication. In order to achieve successful decomposition, SADP-compliant design becomes a necessity. Spacer-Is-Dielectric (SID) is the most popular flavor of SADP with higher flexibility in de- sign. This paper makes a careful study on the challenges for SID-compliant detailed routing and proposes a graph model to capture the decomposition violations and SID intrinsic residue issues. Then a negotiated congestion based scheme is adopted to solve the overall routing problem. The proposed SID-compliant detailed routing algorithm simultaneously assigns colors to the routed wires, which provides valuable information guiding SID decomposition. In addition, if one pin has multiple candidate locations, the optimal one will be automatically determined during detailed routing. The decomposability of the conict-free routing layers produced by our detailed router is verified by a commercial SADP decomposition tool.",
keywords = "SADP, SID-compliant detailed routing",
author = "Yuelin Du and Qiang Ma and Hua Song and James Shiely and Gerard Luk-Pat and Alexander Miloslavsky and Wong, {Martin D F}",
year = "2013",
month = "7",
day = "12",
doi = "10.1145/2463209.2488848",
language = "English (US)",
isbn = "9781450320719",
series = "Proceedings - Design Automation Conference",
booktitle = "Proceedings of the 50th Annual Design Automation Conference, DAC 2013",

}

TY - GEN

T1 - Spacer-is-dielectric-compliant detailed routing for self-aligned double patterning lithography

AU - Du, Yuelin

AU - Ma, Qiang

AU - Song, Hua

AU - Shiely, James

AU - Luk-Pat, Gerard

AU - Miloslavsky, Alexander

AU - Wong, Martin D F

PY - 2013/7/12

Y1 - 2013/7/12

N2 - Self-aligned double patterning (SADP) lithography is a leading technology for 10nm node Metal layer fabrication. In order to achieve successful decomposition, SADP-compliant design becomes a necessity. Spacer-Is-Dielectric (SID) is the most popular flavor of SADP with higher flexibility in de- sign. This paper makes a careful study on the challenges for SID-compliant detailed routing and proposes a graph model to capture the decomposition violations and SID intrinsic residue issues. Then a negotiated congestion based scheme is adopted to solve the overall routing problem. The proposed SID-compliant detailed routing algorithm simultaneously assigns colors to the routed wires, which provides valuable information guiding SID decomposition. In addition, if one pin has multiple candidate locations, the optimal one will be automatically determined during detailed routing. The decomposability of the conict-free routing layers produced by our detailed router is verified by a commercial SADP decomposition tool.

AB - Self-aligned double patterning (SADP) lithography is a leading technology for 10nm node Metal layer fabrication. In order to achieve successful decomposition, SADP-compliant design becomes a necessity. Spacer-Is-Dielectric (SID) is the most popular flavor of SADP with higher flexibility in de- sign. This paper makes a careful study on the challenges for SID-compliant detailed routing and proposes a graph model to capture the decomposition violations and SID intrinsic residue issues. Then a negotiated congestion based scheme is adopted to solve the overall routing problem. The proposed SID-compliant detailed routing algorithm simultaneously assigns colors to the routed wires, which provides valuable information guiding SID decomposition. In addition, if one pin has multiple candidate locations, the optimal one will be automatically determined during detailed routing. The decomposability of the conict-free routing layers produced by our detailed router is verified by a commercial SADP decomposition tool.

KW - SADP

KW - SID-compliant detailed routing

UR - http://www.scopus.com/inward/record.url?scp=84879861837&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84879861837&partnerID=8YFLogxK

U2 - 10.1145/2463209.2488848

DO - 10.1145/2463209.2488848

M3 - Conference contribution

AN - SCOPUS:84879861837

SN - 9781450320719

T3 - Proceedings - Design Automation Conference

BT - Proceedings of the 50th Annual Design Automation Conference, DAC 2013

ER -