Skip to main navigation
Skip to search
Skip to main content
Illinois Experts Home
LOGIN & Help
Link opens in a new tab
Search content at Illinois Experts
Home
Profiles
Research units
Research & Scholarship
Datasets
Honors
Press/Media
Activities
Solution-processed soldering of carbon nanotubes for flexible electronics
K. D.M. Rao
, B. Radha
,
K. C. Smith
, T. S. Fisher
, G. U. Kulkarni
Research output
:
Contribution to journal
›
Article
›
peer-review
Overview
Fingerprint
Fingerprint
Dive into the research topics of 'Solution-processed soldering of carbon nanotubes for flexible electronics'. Together they form a unique fingerprint.
Sort by
Weight
Alphabetically
Keyphrases
Carbon Nanotubes
100%
Electrical Activation
75%
Electro-thermal Model
25%
Estimated Temperature
25%
Flexible Electronics
100%
Flexible Substrate
25%
Joule Heating
25%
Lithography-free
25%
Multi-walled Carbon Nanotubes (MWCNTs)
100%
Nanomolding
25%
Ohmic Contact
25%
Pd2+
25%
Selective Retention
25%
Self-assembling
25%
Solder Joint
25%
Soldering
100%
Solution Process
100%
Solution-based Method
25%
Solvent Evaporation
25%
Specific Contact Resistance
25%
Thermoelectric Properties
25%
Transmission Line Model
25%
Ultrasonication
25%
Engineering
Carbon Nanotube
100%
Electric Lines
25%
Electrode Gap
50%
Flexible Electronics
100%
Flexible Substrate
25%
Free Solution
25%
Lithography
25%
Monolayers
25%
Multi-Walled Carbon Nanotube
100%
Ohmic Contacts
25%
Resistance Heating
25%
Soldered Joints
25%
Solvent Evaporation
25%
Thermal Model
25%
Ultrasonication
25%
Material Science
Carbon Nanotube
100%
Contact Resistance
16%
Lithography
16%
Monolayers
16%
Chemical Engineering
Carbon Nanotube
100%
Joule Heating
16%
Lithography
16%