Solution-mediated selective nanosoldering of carbon nanotube junctions for improved device performance

Jae Won Do, Noel N. Chang, David Estrada, Feifei Lian, Hyeongyun Cha, Xiangyun J. Duan, Richard T. Haasch, Eric Pop, Gregory S. Girolami, Joseph W. Lyding

Research output: Contribution to journalArticlepeer-review


As-grown randomly aligned networks of carbon nanotubes (CNTs) invariably suffer from limited transport properties due to high resistance at the crossed junctions between CNTs. In this work, Joule heating of the highly resistive CNT junctions is carried out in the presence of a spin-coated layer of a suitable chemical precursor. The heating triggers thermal decomposition of the chemical precursor, tris(dibenzylideneacetone)dipalladium (Pd2(dba)3), and causes local deposition of Pd nanoparticles at the CNT junctions, thereby improving the on/off current ratio and mobility of CNT network devices by an average factor of ∼6. This process can be conducted either in air or under vacuum depending on the characteristics of the precursor species. The solution-mediated nanosoldering process is simple, fast, scalable with manufacturing techniques, and extendable to the nanodeposition of a wide variety of materials.

Original languageEnglish (US)
Pages (from-to)4806-4813
Number of pages8
JournalACS Nano
Issue number5
StatePublished - May 26 2015


  • carbon nanotubes (CNT)
  • electrical resistance
  • intertube junctions
  • nanosoldering
  • solution deposition
  • thermal resistance

ASJC Scopus subject areas

  • General Materials Science
  • General Engineering
  • General Physics and Astronomy


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