Solderability of tinned FeNi under bump material

Cai Chen, Lei Zhang, J. K. Shang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Finding new under bump materials (UBM) is of significant importance with the shrinkage of pitch size in advanced high density packaging. FeNi alloy has been found to be a good UBM candidate for its slower interfacial reaction during reflow and aging. However, solderability of FeNi has to be improved. 58Fe42Ni and 92Fe8Ni alloy platings with electrodeposited tin finish were investigated by wetting balance method in a SnAgCu liquid bath. Results showed that tin finish can reduce the initial wetting time tb of 58Fe42Ni and change the non solderable 92Fe8Ni to be the same wetting performance as 58Fe42Ni. The maximum wetting force of tin finished both FeNi alloys were larger than the bare alloy. However, after the maximum was reached, a slight decline of the wetting force was observed. The decline depended on the thickness of tin finish, with the thicker tin finish resulting in a higher steady plateau on the wetting force curve.

Original languageEnglish (US)
Title of host publication2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009
Pages670-673
Number of pages4
DOIs
StatePublished - Nov 25 2009
Event2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009 - Beijing, China
Duration: Aug 10 2009Aug 13 2009

Publication series

Name2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009

Other

Other2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009
CountryChina
CityBeijing
Period8/10/098/13/09

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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    Chen, C., Zhang, L., & Shang, J. K. (2009). Solderability of tinned FeNi under bump material. In 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009 (pp. 670-673). [5270666] (2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009). https://doi.org/10.1109/ICEPT.2009.5270666