Solderability of electrodeposited Fe-Ni alloys with eutectic SnAgCu solder

Jianjun Guo, Lei Zhang, Aiping Xian, J. K. Shang

Research output: Contribution to journalArticlepeer-review

Abstract

Solderabilities of electrodeposited Fe-Ni alloys with SnAgCu solder were examined by wetting balance measurements and compared to those of pure Ni and pure Fe platings. Excellent solderability was found on the Ni-52Fe plating as both the wetting force and kinetics approached or exceeded those on the pure Ni. However, upon further increase in Fe content to 75 at. pct, the solderability of the alloy was severely degraded even though it was still better than that of the pure Fe plating. X-ray photoelectron spectroscopy showed that such a strong dependence of solderability on Fe content is related to the much thinner, incomplete oxide coverage of Ni-rich plating surface.

Original languageEnglish (US)
Pages (from-to)811-816
Number of pages6
JournalJournal of Materials Science and Technology
Volume23
Issue number6
StatePublished - Nov 1 2007

Keywords

  • FeNi alloys
  • Lead-free solders
  • Solderability
  • Wetting

ASJC Scopus subject areas

  • Ceramics and Composites
  • Mechanics of Materials
  • Mechanical Engineering
  • Polymers and Plastics
  • Metals and Alloys
  • Materials Chemistry

Fingerprint Dive into the research topics of 'Solderability of electrodeposited Fe-Ni alloys with eutectic SnAgCu solder'. Together they form a unique fingerprint.

Cite this