Abstract
The present invention provides a method and apparatus for surface relief output coupling in organic light emitting diodes is provided. The method includes forming a pattern in a surface of an elastomer (310) and laminating at least a portion of the pattern to a surface of an organic light emitting diode (305).
| Original language | English (US) |
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| U.S. patent number | 8685195 |
| Filing date | 1/29/07 |
| State | Published - Apr 1 2014 |