@article{084910418a244b72a0d895313c0e6019,
title = "Soft lithographic fabrication of an image sensor array on a curved substrate",
abstract = "The use of soft lithography for fabricating Si:H photoconductive sensors was demonstrated on a convex glass substrate was demonstrated. It was observed that soft lithography could be used for device fabrication on non-planar substrates. It was also observed that the process including metal and semiconductor deposition was compatible with flexible plastic substrates.",
author = "Jin, {Hyun Chul} and Abelson, {John R.} and Erhardt, {Martin K.} and Nuzzo, {Ralph G.}",
note = "Funding Information: The authors thank Professor Ilesanmi Adesida and Jaehyung Jang (Department of Electrical and Computer Engineering, UIUC) for their help with the use of the probe station. This work was supported by the Department of Energy through the Seitz Materials Research Laboratory at the University of Illinois at Urbana-Champaign (DEFG02-91ER45439), the National Science Foundation CHE0097096), and DARPA. Sample analyses were carried out in the Center for Microanalysis of Materials, University of Illinois, which is supported by the U. S. Department of Energy under Grant No. DOE DEFG02-91ER45439.",
year = "2004",
month = sep,
doi = "10.1116/1.1795249",
language = "English (US)",
volume = "22",
pages = "2548--2551",
journal = "Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures",
issn = "1071-1023",
publisher = "AVS Science and Technology Society",
number = "5",
}