The use of soft lithography for fabricating Si:H photoconductive sensors was demonstrated on a convex glass substrate was demonstrated. It was observed that soft lithography could be used for device fabrication on non-planar substrates. It was also observed that the process including metal and semiconductor deposition was compatible with flexible plastic substrates.
|Original language||English (US)|
|Number of pages||4|
|Journal||Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures|
|State||Published - Sep 1 2004|
ASJC Scopus subject areas
- Condensed Matter Physics
- Electrical and Electronic Engineering