Abstract
The sintering of sputtered copper nanoparticles with a thin film copper substrate has been studied in real time using a novel in-situ UHV TEM. Particles were generated by dc sputtering in argon and transferred directly into the microscope along a connecting tube. The particles were deposited onto a clean (001) copper substrate of thickness 40 nm. As-deposited particles assume a random orientation on the copper substrate as evidenced by electron diffraction patterns. Upon annealing, however, the particles were observed to reorient and assume the orientation of the substrate. Reorientation of individual, isolated particles occurred at approximately 200 °C, primarily by grain-boundary motion and not by surface diffusion.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 179-184 |
| Number of pages | 6 |
| Journal | Materials Research Society Symposium - Proceedings |
| Volume | 457 |
| State | Published - 1997 |
| Event | Proceedings of the 1996 MRS Fall Symposium - Boston, MA, USA Duration: Dec 2 1996 → Dec 5 1996 |
ASJC Scopus subject areas
- General Materials Science
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering