Sintering of silver and copper nanoparticles on (001) copper observed by in-situ ultrahigh vacuum transmission electron microscopy

M. Yeadon, J. C. Yang, R. S. Averback, J. W. Bullard, J. M. Gibson

Research output: Contribution to journalConference articlepeer-review

Abstract

The sintering of copper and silver nanoparticles with single crystal copper substrates has been studied using a novel in-situ ultrahigh vacuum transmission electron microscope (UHV TEM). The system is equipped with a UHV DC sputtering attachment enabling metal nanoparticles to be generated in-situ and transferred directly into the microscope in the gas phase. In both cases, we find the particles to be of initially random orientation on the substrate. Upon annealing, however, the particles reorient and assume the same orientation as the substrate. The process apparently occurs by a mechanism involving sintering and grain growth. In the case of silver on copper, grain growth cannot occur since the metals are immiscible. Our observations show that, upon annealing, the particles wet the substrate surface and form epitaxially oriented islands by surface diffusion and grain boundary migration. The post-anneal islands exhibit the orientation relationship (111)Ag∥(001)Cu, [110]Ag∥[110]Cu.

Original languageEnglish (US)
Pages (from-to)731-739
Number of pages9
JournalNanostructured Materials
Volume10
Issue number5
DOIs
StatePublished - Jan 1 1998
EventProceedings of the 1998 TMS Annual Meeting & Exposition - San Antonio, TX, USA
Duration: Feb 15 1998Feb 19 1998

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics

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