Sintering of nanoparticle assemblies: studies using molecular dynamics simulations

H. Zhu, M. Ghaly, Robert S Averback

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The sintering of small assemblies of metal nanoparticles was studied using molecular dynamics computer simulations. The work demonstrates that owing to the large shear stresses that develop at interparticle contacts, sintering of nanoparticles can take place on a time scale of tens of picoseconds. The sintering mechanism, however, differed for different types of metals examined, pure Cu and Ni, and intermetallic and amorphous CuTi. It also varied with the size of the nanoparticles. For 5 nm particles of either Cu or Ni, mass transport occurred by a dislocation mechanism. Grain boundary energies also strongly influenced the sintering behavior of these systems, with crystallographically misaligned nano-particles rotating to form a low energy grain boundaries. For smaller particles, the contact of two particles led to the shearing of one of the them into two separate grains. Sintering in amorphous CuTi and intermetallic CuTi did not involve slip, but rather viscous flow of mass along the interparticle boundaries.

Original languageEnglish (US)
Title of host publicationChemistry and Physics of Nanostructures and Related Non-Equilibrium Materials
EditorsE. Ma, B. Fultz, R. Shull, J. Morral, P. Nash
PublisherMinerals, Metals & Materials Soc (TMS)
Pages55-62
Number of pages8
StatePublished - 1997
EventProceedings of the 1997 TMS Annual Meeting - Orlando, FL, USA
Duration: Feb 9 1997Feb 13 1997

Other

OtherProceedings of the 1997 TMS Annual Meeting
CityOrlando, FL, USA
Period2/9/972/13/97

ASJC Scopus subject areas

  • Geology
  • Metals and Alloys

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