Single-Phase and Two-Phase Liquid Immersion Cooling of Data Center Power Supply Units for Heat Capture

Haoyun Qiu, Pouya Kabirzadeh, Vivek S. Garimella, Arjit Bali, Keerthivasan Gurusami, Kang Joon Lee, Andrew Stillwell, Todd Salamon, Nenad Miljkovic

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Data center power supply units (PSU) have high power density due to the increasing power demand and their low profiles. Air cooling proves to be increasingly difficult in mitigating the hot spots, and it also consumes extra energy in fluid delivery, air conditioning, and rejection to the ambience. In this work, we redesign and modify the PSU cooling infrastructure and adopt quiescent immersion cooling. This design removes all active air-cooling elements and enables heat capture. The PSU used in the experiments is a 2 kW 80 Plus Platinum commercial unit (Bel PET2000-12-074RA). The cooling performance was characterized by tracking the steady-state case temperatures of the switching semiconductors. Flutec PP1 was used to study the cooling performance variations with respect to PSU load and capture temperature. Conventional fan-cooled PSU with heat sinks served as the benchmark. Experiments show that two-phase immersion cooling grants an overall enhancement of 4.4× over the original air-cooling approach at 40 °C heat capture. The results suggest that heat rejection from the dielectric fluid to the riding heatsink is the main bottleneck, and further reduction of the thermal resistance would allow heat capture at a temperature closer to the liquid boiling point. The PSU thermal management approach studied here can help lower data center power usage effectiveness (PUE) while increasing PSU power delivery density.

Original languageEnglish (US)
Title of host publicationProceedings of the 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2024
PublisherIEEE Computer Society
ISBN (Electronic)9798350364330
DOIs
StatePublished - 2024
Event23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2024 - Denver, United States
Duration: May 28 2024May 31 2024

Publication series

NameInterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
ISSN (Print)1936-3958

Conference

Conference23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2024
Country/TerritoryUnited States
CityDenver
Period5/28/245/31/24

Keywords

  • datacenter
  • immersion cooling
  • power electronics

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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