@inproceedings{43586a3c7a2f4415b6672feed200077b,
title = "Single-Phase and Two-Phase Liquid Immersion Cooling of Data Center Power Supply Units for Heat Capture",
abstract = "Data center power supply units (PSU) have high power density due to the increasing power demand and their low profiles. Air cooling proves to be increasingly difficult in mitigating the hot spots, and it also consumes extra energy in fluid delivery, air conditioning, and rejection to the ambience. In this work, we redesign and modify the PSU cooling infrastructure and adopt quiescent immersion cooling. This design removes all active air-cooling elements and enables heat capture. The PSU used in the experiments is a 2 kW 80 Plus Platinum commercial unit (Bel PET2000-12-074RA). The cooling performance was characterized by tracking the steady-state case temperatures of the switching semiconductors. Flutec PP1 was used to study the cooling performance variations with respect to PSU load and capture temperature. Conventional fan-cooled PSU with heat sinks served as the benchmark. Experiments show that two-phase immersion cooling grants an overall enhancement of 4.4× over the original air-cooling approach at 40 °C heat capture. The results suggest that heat rejection from the dielectric fluid to the riding heatsink is the main bottleneck, and further reduction of the thermal resistance would allow heat capture at a temperature closer to the liquid boiling point. The PSU thermal management approach studied here can help lower data center power usage effectiveness (PUE) while increasing PSU power delivery density.",
keywords = "datacenter, immersion cooling, power electronics",
author = "Haoyun Qiu and Pouya Kabirzadeh and Garimella, {Vivek S.} and Arjit Bali and Keerthivasan Gurusami and Lee, {Kang Joon} and Andrew Stillwell and Todd Salamon and Nenad Miljkovic",
note = "Publisher Copyright: {\textcopyright} 2024 IEEE.; 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2024 ; Conference date: 28-05-2024 Through 31-05-2024",
year = "2024",
doi = "10.1109/ITherm55375.2024.10709424",
language = "English (US)",
series = "InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM",
publisher = "IEEE Computer Society",
booktitle = "Proceedings of the 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2024",
address = "United States",
}