Simultaneous wireless power transfer and communication to chip-scale devices

Brandon Arakawa, Liuqing Gao, Yansong Yang, Junfeng Guan, Anming Gao, Ruochen Lu, Songbin Gong

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper reports a 2.48 GHz tri-coil and rectifier design implemented in a system that demonstrates simultaneous wireless power transfer and communication to a 0.1 mm by 0.1 mm coil. The tri-coil link and rectifier successfully rectified and demodulated a 20 dBm amplitude-shift keyed (ASK) RF signal modulated at a rate of 1 Mb/s. Additionally, a 5.7 GHz tri-coil link was fabricated to validate the frequency scalability of this technology platform for other unlicensed bands and was measured in a customized experimental testbed to account for the effects of lateral misalignment between coils. The 5.7 GHz tri-coil design had a measured peak RF power transfer efficiency of -29 dB with a vertical separation of 1 mm, which is ten times the load coil diameter.

Original languageEnglish (US)
Title of host publication2017 IEEE MTT-S International Microwave Symposium, IMS 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages311-314
Number of pages4
ISBN (Electronic)9781509063604
DOIs
StatePublished - Oct 4 2017
Event2017 IEEE MTT-S International Microwave Symposium, IMS 2017 - Honololu, United States
Duration: Jun 4 2017Jun 9 2017

Publication series

NameIEEE MTT-S International Microwave Symposium Digest
ISSN (Print)0149-645X

Other

Other2017 IEEE MTT-S International Microwave Symposium, IMS 2017
CountryUnited States
CityHonololu
Period6/4/176/9/17

Keywords

  • Envelope detectors
  • Near field communication
  • Rectifiers
  • Wireless power transmission

ASJC Scopus subject areas

  • Radiation
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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  • Cite this

    Arakawa, B., Gao, L., Yang, Y., Guan, J., Gao, A., Lu, R., & Gong, S. (2017). Simultaneous wireless power transfer and communication to chip-scale devices. In 2017 IEEE MTT-S International Microwave Symposium, IMS 2017 (pp. 311-314). [8059106] (IEEE MTT-S International Microwave Symposium Digest). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MWSYM.2017.8059106