Abstract
The paper presents an aspect of simultaneouse switching noise (SSN) for CMOS drivers in packages with power distribution planes. The analysis takes into account the interactions between power distribution planes and signal traces. Coupling between these have a significant effect on the noise and must be taken into account. A model for the interaction between the signal conductors and the current paths in the power distribution planes is presented. The presence of the signal conductors is seen to have a significant impact on the SSN. The magnitude of the noise is strongly dependent on the relative positions of the signal conductors and the power and ground plane pin connections. Power and ground planes sufficiently close to each other also have significant mutual inductive coupling. This coupling will cause noise to be observed in both distribution planes, even though switching current flows in only one plane. This effect is explained.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 496-502 |
| Number of pages | 7 |
| Journal | IEEE Transactions on Components Packaging and Manufacturing Technology Part B |
| Volume | 18 |
| Issue number | 3 |
| DOIs | |
| State | Published - Aug 1995 |
| Externally published | Yes |
ASJC Scopus subject areas
- Engineering(all)