Simultaneous 3D Component Packing and Routing Optimization Using Geometric Projection

This paper presents a novel three-dimensional topology optimization framework developed for 3D system spatial packaging using a geometric projection method. The proposed gradient-based topology optimization method simultaneously optimizes the locations and orientations of system components (or devices) and interconnects within the prescribed 3D design domain. The optimization is subject to geometric and physics-based constraints dictated by various system specifications, suited for a wide range of transportation (aerospace, or automotive), HVACR (heating, ventilation, air-conditioning, and refrigeration), and other complex system applications. The system components and interconnects are represented using 3D parametric shapes such as cubes, cuboids, and cylinders. These objects are then projected onto a three-dimensional mesh using a geometric projection method. Sensitivities are calculated for the objective function (bounding box volume) with various geometric constraints. Case studies with different component counts and interconnection topologies are presented to exhibit the capabilities of the proposed framework.