Simulation of shape evolution during electrodeposition of copper in the presence of additive

Keyphrases

• Shape Evolution 100%
• Aspect Ratio 100%
• Copper Electrodeposition 100%
• Plating Solution 50%
• Sulfuric Acid 50%
• Electrodeposition 50%
• Fluid Flow 50%
• Mathematical Model 50%
• Convection 50%
• Complex Geometry 50%
• Behavior Change 50%
• Shape Change 50%
• Operating Window 50%
• Bulk Composition 50%
• Flow Transport 50%
• Copper Sulfate 50%
• Bulk Concentration 50%
• Additive Components 50%
• Multiple Reactions 50%
• Adaptive Meshing 50%
• Microtrench 50%
• Void-free 50%
• Plating Additives 50%

Material Science

• Electrodeposition 100%
• Plating 66%
• Fluid Flow 33%

Chemical Engineering

• Electrodeposition 100%
• Fluid Flow 33%