Simulation of shape evolution during electrodeposition of copper in the presence of additive

M. Georgiadou, D. Veyret, R. L. Sani, R. C. Alkire

Research output: Contribution to journalArticlepeer-review


Shape evolution during electrodeposition of copper in microtrenches was studied numerically by a model which incorporates adaptive meshing capabilities. Filling of trenches with copper without creating a void was related to plating additives in solution. The shape-change behavior of this system resulting from variation of the feature's aspect ratio, bulk composition, and level of additive components was investigated. The operating window of bath conditions for void-free electrodeposition was studied in the range of 0.25×10-4 to 10-4 M bulk concentration of additive in a 0.25 M CuSO4+0.2 M H2SO4 plating solution and for aspect ratios (depth:width) from 0.5 to 4. The mathematical model includes fluid flow, transport by diffusion, migration and convection, multiple species, and reactions in complex geometries.

Original languageEnglish (US)
Pages (from-to)C54-C58
JournalJournal of the Electrochemical Society
Issue number1
StatePublished - Jan 2001

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Materials Chemistry
  • Surfaces, Coatings and Films
  • Electrochemistry
  • Renewable Energy, Sustainability and the Environment


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