Simulation of ion conduction in α-hemolysin nanopores with covalently attached β-cyclodextrin based on Boltzmann Transport Monte Carlo model

Reza Toghraee, Kyu Ii Lee, David Papke, See Wing Chiu, Eric Jakobsson, Umberto Ravaioli

Research output: Contribution to journalArticlepeer-review

Abstract

Ion channels, as nature's solution to regulating biological environments, are particularly interesting to device engineers seeking to understand how natural molecular systems realize device-like functions, such as stochastic sensing of organic analytes. What's more, attaching molecular adaptors in desired orientations inside genetically engineered ion channels, enhances the system functionality as a biosensor. In general, a hierarchy of simulation methodologies is needed to study different aspects of a biological system like ion channels. Biology Monte Carlo (BioMOCA), a threedimensional coarse-grained particle ion channel simulator, offers a powerful and general approach to study ion channel permeation. BioMOCA is based on the Boltzmann Transport Monte Carlo (BTMC) and Particle-Particle-Particle-Mesh (P3 M) methodologies developed at the University of Illinois at Urbana-Champaign. In this paper, we have employed BioMOCA to study two engineered mutations of α-HL, namely (M113F)6 (M113C-D8RL2)1-β-CD and (MIISNO)6 (TmC-D8RL3)1-β-CD. The channel conductance calculated by BioMOCA is slightly higher than experimental values. Permanent charge distributions and the geometrical shape of the channels gives rise to selectivity towards anions and also an asymmetry in l-V curves, promoting a rectification largely for cations.

Original languageEnglish (US)
Pages (from-to)2555-2567
Number of pages13
JournalJournal of Computational and Theoretical Nanoscience
Volume7
Issue number12
DOIs
StatePublished - Dec 2010

Keywords

  • Ion channel
  • Monte Carlo simulation
  • α-hemolysin

ASJC Scopus subject areas

  • General Chemistry
  • General Materials Science
  • Condensed Matter Physics
  • Computational Mathematics
  • Electrical and Electronic Engineering

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