Simulation of Copper Electroplating in Damascene Feature

D. Veyret, M. Georgiadou, R. L. Sani, R. C. Alkire

Research output: Contribution to conferencePaperpeer-review

Abstract

Shape evolution was studied numerically during electrodeposition of copper in microtrenches. Two numerical methods incorporating adaptive meshing capabilities were developed. The models, based on finite element and finite difference, handle transport by diffusion, migration, convection, fluid flow and homogeneous reactions. The shape change behavior of this system was investigated, resulting from variation of the feature's aspect ratio, bulk composition and level of additive components. Filling without creating a void or a seam was related to process parameters, enabling to generate safe maps. The tool is incorporated in a collaborative Web-based modeling environment providing a friendly interface for linking models at a variety of scales.

Original languageEnglish (US)
Pages100-104
Number of pages5
StatePublished - Dec 1 2000
EventAESF SUR/FIN 2000 'Finishing Technology into the Millennium' - Chicago, IL, United States
Duration: Jun 26 2000Jun 29 2000

Other

OtherAESF SUR/FIN 2000 'Finishing Technology into the Millennium'
Country/TerritoryUnited States
CityChicago, IL
Period6/26/006/29/00

ASJC Scopus subject areas

  • Surfaces, Coatings and Films

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