TY - JOUR
T1 - Silicon micro-masonry using elastomeric stamps for three-dimensional microfabrication
AU - Keum, Hohyun
AU - Carlson, Andrew
AU - Ning, Hailong
AU - Mihi, Agustin
AU - Eisenhaure, Jeffrey D.
AU - Braun, Paul V.
AU - Rogers, John A.
AU - Kim, Seok
PY - 2012/5
Y1 - 2012/5
N2 - We present a micromanufacturing method for constructing microsystems, which we term micro-masonry based on individual manipulation, influenced by strategies for deterministic materials assembly using advanced forms of transfer printing. Analogous to masonry in construction sites, micro-masonry consists of the preparation, manipulation, and binding of microscale units to assemble microcomponents and microsystems. In this paper, for the purpose of demonstration, we used microtipped elastomeric stamps as manipulators and built three dimensional silicon microstructures. Silicon units of varied shapes were fabricated in a suspended format on donors, retrieved, delivered, and placed on a target location on a receiver using microtipped stamps. Annealing of the assembled silicon units permanently bound them and completed the micro-masonry procedure.
AB - We present a micromanufacturing method for constructing microsystems, which we term micro-masonry based on individual manipulation, influenced by strategies for deterministic materials assembly using advanced forms of transfer printing. Analogous to masonry in construction sites, micro-masonry consists of the preparation, manipulation, and binding of microscale units to assemble microcomponents and microsystems. In this paper, for the purpose of demonstration, we used microtipped elastomeric stamps as manipulators and built three dimensional silicon microstructures. Silicon units of varied shapes were fabricated in a suspended format on donors, retrieved, delivered, and placed on a target location on a receiver using microtipped stamps. Annealing of the assembled silicon units permanently bound them and completed the micro-masonry procedure.
UR - http://www.scopus.com/inward/record.url?scp=84860469471&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84860469471&partnerID=8YFLogxK
U2 - 10.1088/0960-1317/22/5/055018
DO - 10.1088/0960-1317/22/5/055018
M3 - Article
AN - SCOPUS:84860469471
SN - 0960-1317
VL - 22
JO - Journal of Micromechanics and Microengineering
JF - Journal of Micromechanics and Microengineering
IS - 5
M1 - 055018
ER -