Abstract
Signal integrity has become a critical area in the design of high-speed communications systems and fast computers. Many research areas have emerged from industry and universities to address issues related to electrical performance. However, the educational infrastructure is seriously lagging. In a collaboration between the University of Illinois and the Georgia Tech Packaging Research Center, an internet-based virtual classroom is being explored for packaging education. The effort makes use of the existing infrastructure to implement a modern platform for asynchronous learning.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 1065-1067 |
| Number of pages | 3 |
| Journal | Proceedings - Electronic Components and Technology Conference |
| State | Published - 1999 |
| Event | Proceedings of the 1999 49th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA Duration: Jun 1 1999 → Jun 4 1999 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering