Signal integrity education on the Web

Research output: Contribution to journalConference article

Abstract

Signal integrity has become a critical area in the design of high-speed communications systems and fast computers. Many research areas have emerged from industry and universities to address issues related to electrical performance. However, the educational infrastructure is seriously lagging. In a collaboration between the University of Illinois and the Georgia Tech Packaging Research Center, an internet-based virtual classroom is being explored for packaging education. The effort makes use of the existing infrastructure to implement a modern platform for asynchronous learning.

Original languageEnglish (US)
Pages (from-to)1065-1067
Number of pages3
JournalProceedings - Electronic Components and Technology Conference
StatePublished - Jan 1 1999
EventProceedings of the 1999 49th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA
Duration: Jun 1 1999Jun 4 1999

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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